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Frontiers of Optoelectronics

ISSN 2095-2759

ISSN 2095-2767(Online)

CN 10-1029/TN

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Front. Optoelectron.    2019, Vol. 12 Issue (3) : 249-267    https://doi.org/10.1007/s12200-018-0857-2
REVIEW ARTICLE
Development of optical-thermal coupled model for phosphor-converted LEDs
Xinglu QIAN1, Jun ZOU1,2(), Mingming SHI1, Bobo YANG1, Yang LI3, Ziming WANG3, Yiming LIU3, Zizhuan LIU1, Fei ZHENG1
1. School of Science, Shanghai Institute of Technology, Shanghai 201418, China
2. Zhejiang Emitting Optoelectronic Technology Co, Ltd., Zhejiang 314100, China
3. School of Material Science and Engineering, Shanghai Institute of Technology, Shanghai 201418, China
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Abstract

In this review, first, we discussed the effect of phosphor features on optical properties by the software simulation in detail. A combination of these parameters: phosphor material, phosphor particle size and particle distribution, phosphor layer concentration, phosphor layer thickness, geometry, and location of the phosphor layer, will result in the final optical performance of the phosphor layer. Secondly, we introduced how to improve light extraction efficiency with various proposed methods. Thirdly, we summarized the thermal models to predict the phosphor temperature and the junction temperature. To stabilize the optical performance of phosphor-converted light emitting diodes (PC-LEDs), much effort has been made to reduce the junction temperature of the LED chips. The phosphor temperature, a critical reliability concern for PC-LEDs, should be attracted academic interest. Finally, we summed up optical-thermal coupled model for phosphors and summarized future optical- thermal issues exploring the light quality for LEDs. We foresee that optical-thermal coupled model for PC-LEDs should be paid more attention in the future.

Keywords phosphor-converted light emitting diodes (PC-LEDs)      optical-thermal coupled model      software simulation     
Corresponding Author(s): Jun ZOU   
Just Accepted Date: 29 November 2018   Online First Date: 22 January 2019    Issue Date: 16 September 2019
 Cite this article:   
Xinglu QIAN,Jun ZOU,Mingming SHI, et al. Development of optical-thermal coupled model for phosphor-converted LEDs[J]. Front. Optoelectron., 2019, 12(3): 249-267.
 URL:  
https://academic.hep.com.cn/foe/EN/10.1007/s12200-018-0857-2
https://academic.hep.com.cn/foe/EN/Y2019/V12/I3/249
Fig.1  Sketch of the simulation model: (a) LED die with a phosphor-layer placed on its top, (b) LED light source with a hemispherical detector, and (c) LED light source with a segmented detector configuration. For the phosphor-layer the height h, the width b and the concentration c of the phosphor particles in the silicone matrix are varied throughout the simulations. Both the hemispherical and the segmented detector have a radius of 1 cm. The hemispherical detector is divided into 101 pixels along the principle axes while the segmented detector consists of 61 segments (Adapted from Ref. [27], Copyright 2008, Elsevier)
Fig.2  Typical structures of in-cup phosphor converted white LEDs (PC-WLEDs) with (a) flat, (b) convex, and (c) concave phosphor layer (Adapted from Ref. [34], Copyright 2011, IEEE)
Fig.3  Schematic cross-sectional view of PC-WLEDs with (a) in-cup phosphor, (b) top remote phosphor (Adapted from Ref. [35], Copyright 2009, IEEE)
Fig.4  Schematic of surface roughening or optical radiation of a patterned chip. (A) Roughening; (b) patterning
Fig.5  Patterned chip surface structure and its light effect to enhance the effect: (a) surface structure; (b) flat surface chip and patterned surface chip luminous efficiency comparison chart
Fig.6  Schematic drawing of the substrate. (a) Cone pattern; (b) hemispherical pattern
Fig.7  Schematic diagram of the LED chip model’s structure (Adapted from Ref. [40], Copyright 2015, IOP)
Fig.8  (a) Luminous fluxes from each facet and (b) total luminous flux of dome-patterned sapphire substrate (DPSS) LED (Adapted from Ref. [40], Copyright 2015, IOP)
Fig.9  EL spectra of LEDs on D-LED and C-LED (Adapted from Ref. [40], Copyright 2015, IOP)
Fig.10  Schematic of three LED packaging structures: (I) LED chip without coating, (II) with silicone coating, and (III) with phosphor coating (Adapted from Ref. [18], Copyright 2016, Elsevier)
Fig.11  Schematic of the heat flow path (left) and the corresponding thermal resistance model (right) for three LED packaging structures (Adapted from Ref. [18], Copyright 2016, Elsevier)
Fig.12  Calculated Qchip and Qphos for packaging structure (III) at different driving current (Adapted from Ref. [18], Copyright 2016, Elsevier)
Fig.13  Calculated and measured Tj and Tph versus driving current (Adapted from Ref. [18], Copyright 2016, Elsevier)
Fig.14  Half-3D view of white LED packages with (a) direct phosphor coating and (b) remote phosphor coating (Adapted from Ref. [65], Copyright 2012, The Japan Society of Applied Physics)
Fig.15  Heat generation of the chip and the phosphor layer with different phosphor coatings (Adapted from Ref. [65], Copyright 2012, The Japan Society of Applied Physics)
Fig.16  Temperature comparisons with the changes in phosphor concentration of LED packages with remote phosphor coating (Adapted from Ref. [65], Copyright 2012, The Japan Society of Applied Physics)
Fig.17  Temperature comparisons with the changes in phosphor concentration of LED packages with direct phosphor coating (Adapted from Ref. [65], Copyright 2012, The Japan Society of Applied Physics)
Fig.18  Schematic of silicone layer with phosphor particles coated on LED chip. Yellow circles denote the phosphor particles, and blue rectangle denotes the LED chip. The remaining gray part denotes the silicone matrix (Adapted from Ref. [66], Copyright 2014, IEEE)
Fig.19  Phosphor temperature distribution by FEM simulations and its histogram distribution. (a) Case 1; (b) Case 2; (c) Case 3 (Adapted from Ref. [66], Copyright 2014, IEEE)
Fig.20  Relationship between PC-LED optical attenuation and junction temperature [70]
Fig.21  Relationship between PC-LED lifetime and junction temperature [70]
Fig.22  Model of spiral LED bulb
Fig.23  Field distribution at different stretching heights
Fig.24  Thermal modelling, it is considered that heat generated by the LED chip only conducts through the layers mainly in a direction perpendicular to bottom surface of the copper heat sink. (a) Thermal model; (b) heat flow path; (c) thermal resistances network [74]
Fig.25  Forward scattering and backscattering functions with invasion depth z in a phosphor layer (Adapted from Ref. [75], Copyright 2014, Elsevier)
Fig.26  Normalized phosphor heat generation function with changing quantum efficiencies
Fig.27  Total phosphor heat generation with different concentrations and thicknesses (Adapted from Ref. [75], Copyright 2014, Elsevier)
Fig.28  Total phosphor heat generation with different phosphor particle sizes and quantum efficiencies (Adapted from Ref. [75], Copyright 2014, Elsevier)
Fig.29  Schematic of the optical-thermal model for laser-excited remote phosphor (LERP) comprising (a) phosphor scattering model and (b) thermal resistance model (Adapted from Ref. [79], Copyright 2017, Elsevier)
Fig.30  Flowchart of the optical-thermal model considering thermal quenching effects (Adapted from Ref. [79], Copyright 2017, Elsevier)
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