In chemical product design, the aim is to formulate a product with desired performance. Ingredients and internal product structure are two key drivers of product performance with direct impact on the mechanical, electrical, and thermal properties. Thus, there is a keen interest in elucidating the dependence of product performance on ingredients, structure, and the manufacturing process to form the structure. Design of product structure, particularly microstructure, is an intrinsically complex problem that involves different phases of different physicochemical properties, mass fraction, morphology, size distribution, and interconnectivity. Recently, computational methods have emerged that assist systematic microstructure quantification and prediction. The objective of this paper is to review these computational methods and to show how these methods as well as other developments in product design can work seamlessly in a proposed performance, ingredients, structure, and manufacturing process framework for the design of structured chemical products. It begins with the desired target properties and key ingredients. This is followed by computation for microstructure and then selection of processing steps to realize this microstructure. The framework is illustrated with the design of nanodielectric and die attach adhesive products.
. [J]. Frontiers of Chemical Science and Engineering, 2021, 15(5): 1033-1049.
Faheem Mushtaq, Xiang Zhang, Ka Y. Fung, Ka M. Ng. Computational design of structured chemical products. Front. Chem. Sci. Eng., 2021, 15(5): 1033-1049.
Local dispersion (orientation, distance between the inclusions)
Shape of inclusion
Sphere, needle, cubic, disk, rod, fiber
Size of inclusion
Micro, nano
Interfacial interaction
Interfacial layer
Crystallinity
Single crystalline, polycrystalline, amorphous
Porosity
Pore size
Tab.2
Macrostructure
Description
Examples of products
Dispersed
One phase is dispersed in a continuous phase
DAA nanodielectrics
Porous
Presence of pores within a structure
Mosquito repellent mat Sound absorption foam
Lamellar
A structure composed of thin, flat, and interchanging lamellae of different materials
Thermal barrier coating Solar cell encapsulant film
Segregated
One phase forms a continuous network in the structure
EMI shield Piezoresistive sensor
Tab.3
Microstructural features
Examples of microstructural features parameters
Graphical representation
Phase fraction
Weight fraction, volume fraction
?
Shape of inclusion
Aspect ratio, roundedness, rectangularity
Particulate
Fibrous
Size of inclusion
Equivalent diameter, particle size distribution
Microparticles
Nanoparticles
Phase distribution
Average nearest center/surface distance between inclusion (interconnectivity), orientation
Preferred orientation
Interconnected
Interfacial interaction
Thickness of interfacial layer
?
Tab.4
Fig.5
Models
Expressions a)
Parallel model
Series model
Effective medium theory (EMT) model
Maxwell model
Hamilton model
Reciprocity model
Tab.5
Fig.6
Fig.7
Product structure
Processing routes
Property and resultant structure a)
Macro-structure
Microstructural features
Key processing techniques
Equipment design
Operating conditions
Segregated
Volume fraction, size and shape of inclusion, interconnectivity
Mechanical grinding, Hot pressing
Dimensions of mechanical grinder, and its blade design
Time and speed of grinding, time, temperature and pressure for hot pressing
Thermal conductivity= 0.37 W?m–1?K–1
Melt mixing Hot pressing
Dimensions of the mixer, and its mixing blade design
Time, temperature and mechanical power of mixing time, temperature and pressure for pressing
Thermal conductivity= 0.30 W?m–1?K–1
Tab.6
Fig.8
Processing techniques
Equipment
Functions
Process parameters
Sonication
Ultrasonicator
Disperse nanoparticles, surface modification of nanoparticles to prevent agglomeration
Sonic power, time
Mixing
Shear mixer
Disperse the silica nanoparticles in epoxy, control particle size
Mechanical speed, time
Drying
Vacuum oven
Remove solvent and coupling agent
Temperature, time
Mixing
Shear mixer
Mix the curing agent with the polymer mixture
Mechanical speed, time
Degassing
Vacuum desiccator
Remove air bubbles and moisture
Time
Casting and curing
Pre-defined mold oven
Form the solid composite
Temperature, time
Tab.7
Fig.9
Fig.10
Processing techniques
Equipment
Functions
Process parameters
Mixing
Mechanical stirrer
Mix the particles with epoxy
Mechanical speed, time
Homogenization
Homogenizer
Disperse fillers in the polymer matrix
Mechanical speed, time
Sonication
Ultrasonicator
Disperse fillers in the polymer matrix
Sonic power, time
Drying
Oven
Remove solvent
Temperature, time
Mixing
Mixer
Mix the curing agent with the polymer mixture
Mechanical speed, time
Molding and curing
Pre-defined mold oven
Form the solid composite
Temperature, time
Tab.8
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