Please wait a minute...
Frontiers of Electrical and Electronic Engineering

ISSN 2095-2732

ISSN 2095-2740(Online)

CN 10-1028/TM

Front Elect Electr Eng Chin    2009, Vol. 4 Issue (2) : 234-238    https://doi.org/10.1007/s11460-009-0043-9
RESEARCH ARTICLE
Design, fabrication and characterization of dual-channel real space transfer transistor
Weilian GUO(), Shilin ZHANG, Xin YU
School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China
 Download: PDF(161 KB)   HTML
 Export: BibTeX | EndNote | Reference Manager | ProCite | RefWorks
Abstract

In this paper, using a δ-doping dual-channel structure and GaAs substrate, a real space transfer transistor (RSTT) is designed and fabricated successfully. It has the standard Λ-shaped negative resistance I-V characteristics as well as a level and smooth valley region that the conventional RSTT has. The negative resistance parameters can be varied by changing gate voltage (VGS). For example, the PVCR varies from 2.1 to 10.6 while VGS changes from 0.6 V to 1.0 V. The transconductance for IP (ΔIP/ΔVGS) is 0.3 mS. The parameters of VP, VV and threshold gate voltage (VT) for negative resistance characteristics arising are all smaller than the value reported in the literature. Therefore, this device is suitable for low dissipation power application.

Keywords real space transfer transistor (RSTT)      high speed compound three terminal function device      three terminal negative resistance device      hot electron device      electron transfer device     
Corresponding Author(s): GUO Weilian,Email:xinyufisher@gmail.com   
Issue Date: 05 June 2009
 Cite this article:   
Weilian GUO,Shilin ZHANG,Xin YU. Design, fabrication and characterization of dual-channel real space transfer transistor[J]. Front Elect Electr Eng Chin, 2009, 4(2): 234-238.
 URL:  
https://academic.hep.com.cn/fee/EN/10.1007/s11460-009-0043-9
https://academic.hep.com.cn/fee/EN/Y2009/V4/I2/234
Fig.1  Schematic diagram of dual-channel RSTT materials and device structure
Fig.2  Photograph of fabricated dual-channel RSTT
Fig.3  Drain-source - characteristics of dual-channel RSTT. (a) RSTT with low ; (b) RSTT with high
Fig.4  NDR parameters of RSTT with low . (a) , , vs ; (b) , , PVCR vs
Fig.5  , , , , PVCR vs of RSTT with high
Fig.6  - characteristics of three-terminal NDR device with resistive gate
VP/VIP/mAPVCRVGST/V(ΔIP/ΔVGS)/S
Ref. [3]1.44083not enough data
this work0.2460.04677-100.43.0×10-4
Tab.1  Comparison of NDR parameters of RSTT between this work and Ref. []
1 Luryi S, Kastalsky A, Gossard A C, Hendel R H. Charge injection transistor based on real-space hot-electron transfer. IEEE Transactions on Electron Device , 1984, 31(6): 832–839
doi: 10.1109/T-ED.1984.21616
2 Grinberg A A, Kastalsky A, Luryi S. Theory of hot-electron injection in CHINT/NERFET devices. IEEE Transactions on Electron Devices , 1987, 34(2): 409–419
doi: 10.1109/T-ED.1987.22937
3 Wu C L, Hsu W C. Enhanced resonant tunneling real-space transfer in δ-doped GaAs/InGaAs gated dual-channel transistors grown by MOCVD. IEEE Transactions on Electron Devices , 1996, 43(2): 207–212
doi: 10.1109/16.481719
4 Chen Y W, Hsu W C, Shieh H M, Chen Y J, Lin Y S, Li Y J, Wang T B. High breakdown characteristic δ-doped InGaP/InGaAs/AlGaAs tunneling real-space transfer HEMT. IEEE Transactions on Electron Devices , 2002, 49(2): 221–225
doi: 10.1109/16.981210
5 Li G R, Zheng H Z, Li Y X, Guo C Y, Li C F, Zhang P H, Yang X P. Heterostructure charge injection transistor. Chinese Journal of Semiconductors , 1996, 17(3): 203–206 (in Chinese)
6 Sze S M. Physics of Semiconductor Devices. USA: John Wiley & Sons, 1985, 613
7 Wei H C, Wang Y H, Houng M P. N-shaped negative differential resistance in a transistor structure with a resistive gate. IEEE Transactions on Electron Devices , 1994, 41(8): 1327–1333
doi: 10.1109/16.297725
Viewed
Full text


Abstract

Cited

  Shared   
  Discussed