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Special issue: Blockchain technology application |
Hongfeng CHAI1( ), Xiaohong CHEN2(), Hongwei WANG3() |
1. China UnionPay Co., Ltd., Shanghai 201201, China
2. Institute of Big Data and Internet Innovation, Hunan University of Technology and Business, Changsha 410205, China
3. School of Management, Huazhong University of Science and Technology, Wuhan 430074, China |
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Corresponding Author(s):
Hongfeng CHAI,Xiaohong CHEN,Hongwei WANG
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Issue Date: 16 November 2021
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