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Adhesive application method in MDI-UF particleboard manufacture |
| Wang Weihong, Zhang Xianquan, Lu Renshu |
| Key Laboratory of Bio-based Material Science and Technology of Ministry of Education, Northeast Forestry University, Harbin 150040, China |
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Abstract Chinese wood-based composite manufacturers are plagued with serious formaldehyde emission (F-emission) problems. In this study, we investigated the use of an emulsifiable diphenylmethane-4, 4 -diisocyanate (MDI) -urea formaldehyde (UF) mixture adhesive in particleboard manufacture, in order to decrease F-emission to below 9 mg per 100 g board. We paid close attention to the effect of NH4Cl on MDI-UF curing and the method of adhesive application by differential scanning calorimetric (DSC) analysis and compared mechanical properties. Both results showed that the acidic agent NH4Cl did hinder EMDI-UF curing and it also affected the adhesive application method. We are of the opinion that when EMDI and UF are mixed first, without adding NH4Cl and then sprayed onto particles, mechanical properties will be improved and F-emissions will meet E1 grade requirements.
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Issue Date: 05 June 2006
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