Abstract：Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, and bonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors. The silicon wafer and glass wafer with an Au film resistor were bonded by electrostatic bonding, and then Si-Au alloy bonding was formed by annealing at 400vH for 2 h. The air sealability of the cavity after bonding was finally tested using the N2 filling method. The results indicate that large bond strength was obtained at the bonding interface. This process was used in fabricating a pressure sensor with a sandwich structure. The results indicate that the sensor presented better performances and that the bonding techniques can be used in MEMS packaging.
出版日期: 2006-06-05
引用本文:
. The electrostatic-alloy bonding technique used in MEMS[J]. Frontiers of Mechanical Engineering in China, 2006, 1(2): 238-241.
WANG Wei, CHEN Wei-ping. The electrostatic-alloy bonding technique used in MEMS. Front. Mech. Eng., 2006, 1(2): 238-241.
