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Frontiers of Mechanical Engineering

ISSN 2095-0233

ISSN 2095-0241(Online)

CN 11-5984/TH

邮发代号 80-975

2019 Impact Factor: 2.448

Frontiers of Mechanical Engineering  2024, Vol. 19 Issue (2): 15   https://doi.org/10.1007/s11465-024-0786-2
  本期目录
Cutting edge preparation of microdrills by shear thickening polishing for improved hole quality in electronic PCBs
Jiahuan WANG1,2,3, Mingfeng KE1,2, Jiepei LIAO4, Yu ZHOU1,2, Saurav GOEL3,5, Jaya VERMA3, Xu WANG1,2, Weigang GUO6, Julong YUAN1,2(), Binghai LYU1,2()
1. College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou 310000, China
2. Ultra-precision Machining Center, Key Laboratory of Special Purpose Equipment and Advanced Manufacturing Technology, Zhejiang University of Technology, Hangzhou 310000, China
3. School of Engineering, London South Bank University, London SE1 0AA, UK
4. Shenzhen Jinzhou Precision Technology Corporation, Shenzhen 518116, China
5. Department of Mechanical Engineering, University of Petroleum and Energy Studies, Dehradun 248007, India
6. Special Equipment Institute, Hangzhou Vocational & Technical College, Hangzhou 310018, China
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Abstract

Printed circuit boards (PCBs) are representative composite materials, and their high-quality drilling machining remains a persistent challenge in the industry. The finishing of the cutting edge of a microdrill is crucial to drill performance in machining fine-quality holes with a prolonged tool life. The miniature size involving submicron scale geometric dimensions, a complex flute shape, and low fracture toughness makes the cutting edge of microdrills susceptible to breakage and has been the primary limiting factor in edge preparation for microdrills. In this study, a newly developed cutting edge preparation method for microdrills was tested experimentally on electronic printed circuit boards. The proposed method, namely, shear thickening polishing, limited the cutting edge burrs and chipping on the cutting edge, and this in turn transformed the cutting edge’s radius from being sharp to smooth. Moreover, the edge–edge radius could be regulated by adjusting the processing time. PCB drilling experiments were conducted to investigate the influence of different cutting edge radii on wear, hole position accuracy, nail head value, and hole wall roughness. The proposed approach showed 20% enhancement in hole position accuracy, 33% reduction in the nail head value, and 19% reduction in hole wall roughness compared with the original microdrill. However, a threshold is needed; without it, excessive shear thickening polishing will result in a blunt edge, which may accelerate the wear of the microdrill. Wear was identified as the primary factor that reduced hole quality. The study indicates that in printed circuit board machining, microdrills should effectively eliminate grinding defects and maintain the sharpness of the cutting edge as much as possible to obtain excellent drilling quality. Overall, shear thickening polishing is a promising method for cutting edge preparation of microdrills. Further research and optimization can lead to additional improvements in microdrill performance and contribute to the continued advancement of printed circuit board manufacturing.

Key wordsmicrodrill    shear thickening polishing    cutting edge preparation    electronic printed circuit boards    hole quality
收稿日期: 2023-11-09      出版日期: 2024-05-30
Corresponding Author(s): Julong YUAN,Binghai LYU   
 引用本文:   
. [J]. Frontiers of Mechanical Engineering, 2024, 19(2): 15.
Jiahuan WANG, Mingfeng KE, Jiepei LIAO, Yu ZHOU, Saurav GOEL, Jaya VERMA, Xu WANG, Weigang GUO, Julong YUAN, Binghai LYU. Cutting edge preparation of microdrills by shear thickening polishing for improved hole quality in electronic PCBs. Front. Mech. Eng., 2024, 19(2): 15.
 链接本文:  
https://academic.hep.com.cn/fme/CN/10.1007/s11465-024-0786-2
https://academic.hep.com.cn/fme/CN/Y2024/V19/I2/15
Fig.1  
Processing condition Parameter
Abrasive Diamond
Abrasive size Average 2.5 μm
Abrasive concentration 10 wt.%
Depth of immersion 4 mm
Polishing speed 1.3 m/s
Workpiece rotation speed 10 r/min
Polishing time per trial Trial I: 0 min (without STP)
Trial II: 3 min
Trial III: 6 min
Trial IV: 9 min
Tab.1  
Fig.2  
Parameter Value
Spindle speed 115000 r/min
Feed rate 35 mm/s
Retraction speed 300 mm/s
Entry board used Aluminum sheet
Backing board Phenolic resin
Stack of board layers 3
Number of holes drilled 2000
Tab.2  
Fig.3  
Fig.4  
Fig.5  
Fig.6  
Fig.7  
Fig.8  
Fig.9  
Abbreviations
CFRP Carbon fiber-reinforced plastic
CPK Process capability index
PCB Printed circuit board
STP Shear thickening polishing
  
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