Research progress on ultra-precision machining technologies for soft-brittle crystal materials

doi:10.1007/s11465-017-0411-8

Front. Mech. Eng.

2017, Vol. 12

Issue (1) : 77-88 https://doi.org/10.1007/s11465-017-0411-8

REVIEW ARTICLE

Research progress on ultra-precision machining technologies for soft-brittle crystal materials

Hang GAO(

),Xu WANG,Dongming GUO,Yuchuan CHEN

Key Laboratory for Precision and Non-traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China

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Abstract

Soft-brittle crystal materials are widely used in many fields, especially optics and microelectronics. However, these materials are difficult to machine through traditional machining methods because of their brittle, soft, and anisotropic nature. In this article, the characteristics and machining difficulties of soft-brittle and crystals are presented. Moreover, the latest research progress of novel machining technologies and their applications for soft-brittle crystals are introduced by using some representative materials (e.g., potassium dihydrogen phosphate (KDP), cadmium zinc telluride (CZT)) as examples. This article reviews the research progress of soft-brittle crystals processing.

Keywords brittle soft functional crystal ultra-precision machining

Corresponding Author(s): Hang GAO

Just Accepted Date: 16 November 2016 Online First Date: 23 December 2016 Issue Date: 21 March 2017

Cite this article:

Hang GAO,Xu WANG,Dongming GUO, et al. Research progress on ultra-precision machining technologies for soft-brittle crystal materials[J]. Front. Mech. Eng., 2017, 12(1): 77-88.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-017-0411-8
https://academic.hep.com.cn/fme/EN/Y2017/V12/I1/77

Tab.1 Mohs hardness of several kinds of soft-brittle crystals

Fig.1 Mechanism of diamond wire sawing assisted with water dissolution [15]

Fig.2 Schematic diagram of the experimental setup for laser separation of KDP crystals [17]

Fig.3 Schematic diagram of the SPDT setup

Fig.4 Ultra-precision SPDT equipment [23]

Fig.5 Schematic diagram of the micro waviness on the surface after SPDT process [31]

Fig.6 Schematic diagram of precision grinding of CZT wafers [38]

Fig.7 SEM surface topography of CZT wafers after precision grinding by diamond grinding wheels with different diameter abrasives: (a) #800, (b) #1500, (c) #3000, and (d) #5000 [38]

Fig.8 MRF machine (Q22, QED Company)

Fig.9 Stress in the KDPs after (a) SPDT and (b) MRF [44]

Fig.10 Experimental process of KDP 100 mm×100 mm polished using IBF method [47]

Fig.11 Raman spectra of KDP crystal surfaces with and without deliquescence [52]

Fig.12 Schematic diagram of material removal of KDP crystal during water dissolution polishing [56]

Fig.13 Atomic force microscopy measurements of the KDP surface (a) before and (b) after polishing. The dashed lines in (a) indicate the locations of the maximum microwaviness [58]

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