|
|
|
Design and fabrication of waveguide-based chip-to-chip
optical interconnection network on printed circuit boards |
| Zhihua YU1,Fengguang LUO2,Xu DI2,Qing TAO2,Weilin ZHOU2,Bin LI2,Liangjia ZONG2,Guangjun WANG3, |
| 1.Wuhan National Laboratory
for Optoelectronics, College of Optoelectronic Science and Engineering,
Huazhong University of Science and Technology, Wuhan 430074, China;Experimental Teaching
Center of Information Technology, China University of Geosciences,
Wuhan 430074, China; 2.Wuhan National Laboratory
for Optoelectronics, College of Optoelectronic Science and Engineering,
Huazhong University of Science and Technology, Wuhan 430074, China; 3.Experimental Teaching
Center of Information Technology, China University of Geosciences,
Wuhan 430074, China; |
|
|
|
|
Abstract A waveguide-based chip-to-chip optical interconnection network on printed circuit board (PCB) was designed and fabricated, and experiments confirmed that the data rate in each channel could reach above 3.125 Gbit/s and the bit error rate (BER) could be up to 1.27×10−18, which would be a good solution to solve the communication bottlenecks between high-speed very large scale integration chips. Besides, the whole design and fabrication of optical interconnection network on printed circuit board has the advantages of high reliable, low cost and ease of manufacture.
|
|
Issue Date: 05 June 2010
|
|
|
|
|
|
|
Doany F E, Schow C L, Budd R, Baks C, Kuchta D M, Pepeljugoski P, Kash J A, Libsch F, Dangel R, Horst F, Offrein B J. Chip-to-chip board-level optical data bused. In: Proceedings of OFC/NFOEC. 2008, OTHS4
|
|
Luo F G, Cao M C, Zhou X J, Xu J, Luo Z X, Yuan J, Zong L J, Zhang C H. Light waveguide electro-optical printedcircuit board. Proceedings of SPIE, 2007, 6782: 67821T
doi: 10.1117/12.742548
|
|
Kim J T, Ju J J, Park S, Kim M S, Park S K, Lee M H. Chip-to-chip optical interconnect using gold long-rangesurface plasmon polariton waveguides. Optics Express, 2008, 16(17): 13133–13138
doi: 10.1364/OE.16.013133
|
|
Aljada M, Alameh K E, Lee Y T, Chung H S. High-speed (2.5 Gbps) recongigurable inter-chip opticalinterconnects using opto-VLSI processors. Optics Express, 2006, 14(15): 6823–6836
doi: 10.1364/OE.14.006823
|
|
Wang X L, Jiang W, Wang L, Bi H, Chen R T. Fully embedded board-level optical interconnects from waveguide fabrication to device integration. Journal of Lightwave Technology, 2008, 26(2): 243–250
doi: 10.1109/JLT.2007.911115
|
|
Yu Z H, Luo F G, Li B, Zhou W L. Reconfigurable mesh-based inter-chip optical interconnection network for distributed-memorymultiprocessor system. Optik, DOI:
|
Zhou Z G. Fabrication of buried channel optical waveguide splitter. Frontiers of Optoelectronics in China, 2009, 2(1): 28–30
doi: 10.1007/s12200-008-0042-0
|
|
Kintaka K, Nishii J, Murata S, Ura S. 8-channel WDM optical interconnect device using add-dropmultiplexers integrated in a thin-film waveguide. In: Proceedings of Integrated Photonics and Nanophotonics Research andApplications, 2008. ITuA2
|
|
VSC3312. 6.5?Gbps 12×12Asynchronous Crosspoint Switch Datasheet. Revision 2.1, 2006
|
|
Viewed |
|
|
|
Full text
|
|
|
|
|
Abstract
|
|
|
|
|
Cited |
|
|
|
|
| |
Shared |
|
|
|
|
| |
Discussed |
|
|
|
|