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Nano materials for microelectronic and photonic
packaging |
| Ching-Ping WONG,Wei LIN,Ling-Bo ZHU,Hong-Jin JIANG,Rong-Wei ZHANG,Yi LI,Kyoung-Sik MOON, |
| School of Materials
Science and Engineering, Microsystems Packaging Research Center, Georgia
Institute of Technology, Atlanta, GA 30332-0250, USA; |
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Abstract This paper addresses the state-of-the-art nano-science and technology regarding next generation high density microelectronics and photonics packaging applications, including carbon nanotubes (CNTs) for electrical/thermal devices, and molecular wires for electrical interconnects, etc.
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Issue Date: 05 June 2010
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Zhu L B, Sun Y Y, Hess D W, Wong C P. Well-aligned open-ended carbon nanotube architectures: an approach for device assembly. Nano Letters, 2006, 6(2): 243–247
doi: 10.1021/nl052183z
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Zhu L B, Xiu Y H, Hess D W, Wong C P. Aligned carbon nanotube stacks by water-assisted selective etching. Nano Letters, 2005, 5(12): 2641–2645
doi: 10.1021/nl051906b
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Jiang H J, Zhu L B, Moon K S, Wong C P. The preparation of stable metal nanoparticles on carbon nanotubes whose surfaces were modified during production. Carbon, 2007, 45(3): 655–661
doi: 10.1016/j.carbon.2006.10.006
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Jiang H J, Zhu L B, Moon K S. Low temperature carbon nanotube film transfer via conductive polymer composites. Nanotechnology, 2007, 18(12): 125203
doi: 10.1088/0957-4484/18/12/125203
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Lin W, Xiu Y H, Jiang H J, Zhang R W, Hildreth O, Moon K S, Wong C P. Self-assembled monolayer-assisted chemical transfer of in situ functionalized carbon nanotubes. Journal of the American Chemical Society, 2008, 130(30): 9636–9637
doi: 10.1021/ja802142g
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Lin W, Moon K S, Wong C P. A combined process of in situ functionalization and microwave treatment to achieve ultrasmall thermal expansion of aligned carbon nanotube-polymer nanocomposites: toward applications as thermal interface materials. Advanced Materials, 2009, 21(23): 2421–2424
doi: 10.1002/adma.200803548
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Lin W, Zhang R W, Moon K S, Wong C P. Molecular phonon couplers at carbon nanotube/substrate interface to enhance interfacial thermal transport. Carbon, 2010, 48(1): 107–113
doi: 10.1016/j.carbon.2009.08.033
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Lin W, Olivares R V, Liang Q Z, Zhang R W, Moon K S, Wong C P. Vertically aligned carbon nanotubes on copper substrates for applications as thermal interface materials: from synthesis to assembly. In: Proceedings of Electronic Components and Technology Conference. San Diego, 2009, 441–447
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Artaki I, Jackson A M, Vianco P T. Evaluation of lead-free solder joints in electronic assemblies. Journal of Electronic Materials, 1994, 23(8): 757–764
doi: 10.1007/BF02651370
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Lai S L, Guo J Y, Petrova V, Ramanath G, Allen L H. Size-dependent melting properties of small tin particles: nanocalorimetric measurements. Physical Review Letters, 1996, 77(1): 99–102
doi: 10.1103/PhysRevLett.77.99
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Bachels T, Guntherodt H J, Schafer R. Melting of isolated tin nanoparticles. Physical Review Letters, 2000, 85(6): 1250–1253
doi: 10.1103/PhysRevLett.85.1250
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Zhao S J, Wang S Q, Cheng D Y, Ye H Q. Three distinctive melting mechanisms in isolated nanoparticles. Journal of Physical Chemistry B, 2001, 105(51): 12857–12860
doi: 10.1021/jp012638i
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Hu W Y, Xiao S F, Yang J Y, Zhang Z. Melting evolution and diffusion behavior of vanadium nanoparticles. The European Physical Journal B, 2005, 45(4): 547–554
doi: 10.1140/epjb/e2005-00210-8
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Li Y, Moon K S, Wong C P. Electronics without lead. Science, 2005, 308(5727): 1419–1420
doi: 10.1126/science.1110168
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Li Y, Wong C P. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: materials, processing, reliability and applications. Materials Science and Engineering, R: Reports, 2006, R51(1―3): 1–35
doi: 10.1016/j.mser.2006.01.001
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Li Y, Moon K S, Wong C P. Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives. Journal of Electronic Materials, 2005, 34(3): 266–271
doi: 10.1007/s11664-005-0212-4
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Zhang R W, Li Y, Yim M J, Moon K S, Lu D D, Wong C P. Enhanced electrical properties of anisotropic conductive adhesive with pi-conjugated self-assembled molecular wire junctions. IEEE Transactions on Components and Packaging Technology, 2009, 32(3): 677–683
doi: 10.1109/TCAPT.2009.2012720
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Li Y, Yim M J, Wong C P. High performance nonconductive film with π-conjugated self-assembled molecular wires for fine pitch interconnect applications. Journal of Electronic Materials, 2007, 36(5): 549–554
doi: 10.1007/s11664-007-0101-0
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