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Charge trapping memory devices employing multi-layered Ge/Si nanocrystals for storage fabricated with ALD and PLD methods |
Guangli WANG, Yi SHI( ), Lijia PAN( ), Lin PU, Jin LV, Rong ZHANG, Youdou ZHENG |
School of Electronic Science and Technology, Key Laboratory of Photonic and Electronic Materials, Nanjing University, Nanjing 210093, China |
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Abstract The Ge/Si nanocrystals on ultra thin high-k tunnel oxide Al2O3 were fabricated to form the charge trapping memory prototype with asymmetric tunnel barriers through combining the advanced atomic layer deposition (ALD) and pulse laser deposition (PLD) techniques. Charge storage characteristics in such memory structure have been investigated using capacitance-voltage (C-V) and capacitance-time (C-t) measurements. The results prove that both the two-layered and three-layered memory structures behave relatively qualified for the multi-level cell storage. The results also demonstrate that compared to electrons, holes reach a longer retention time even with an ultra thin tunnel oxide owing to the high band offset at the valence band between Ge and Si.
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Keywords
high-k tunnel oxide
equivalent oxide thickness (EOT)
charge trapping memory (CTM) prototype
atomic layer deposition (ALD) technique
multi-level cell (MLC) storage
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Corresponding Author(s):
SHI Yi,Email:yshi@nju.edu.cn; PAN Lijia,Email:ljpan@nju.edu.cn
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Issue Date: 05 June 2011
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