Ceramic-metal package for high power LED lighting

doi:10.1007/s12200-012-0252-3

Front Optoelec

2012, Vol. 5

Issue (2) : 133-137 https://doi.org/10.1007/s12200-012-0252-3

RESEARCH ARTICLE

Ceramic-metal package for high power LED lighting

Yu Jin HEO^1,2, Hyo Tae KIM¹(

), Sahn NAHM², Jihoon KIM¹, Young Joon YOON¹, Jonghee KIM¹

1. Korea Institute of Ceramic Engineering and Technology, Seoul 153–801, Korea; 2. Department of Materials Science and Engineering, Korea University, Seoul 136–701, Korea

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Abstract

High power light-emitting diodes (LEDs) lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market are price and light efficiency, respectively, and they are greatly influenced by the materials and design factors used in high power LED package. This article presents a new design and materials processing technology to realize the solution of LED packaging with advantageous in price and performance. Cost effective materials and processing technology can be realized via thick film glass-ceramic insulating layer and silver conductor. Highly effective thermal design using direct heat dissipation to heat sink in LED package is demonstrated.

Keywords light-emitting diodes (LEDs) package high-power thick film heat dissipation thermal resistance

Corresponding Author(s): KIM Hyo Tae,Email:hytek@kicet.re.kr

Issue Date: 05 June 2012

Cite this article:

Yu Jin HEO,Hyo Tae KIM,Sahn NAHM, et al. Ceramic-metal package for high power LED lighting[J]. Front Optoelec, 2012, 5(2): 133-137.

URL:

https://academic.hep.com.cn/foe/EN/10.1007/s12200-012-0252-3
https://academic.hep.com.cn/foe/EN/Y2012/V5/I2/133

Fig.1 (a) The illustration of a ceramic-metal based LED package and (b) a process flow chart

Fig.2 One-chip mounted LED package test boards.
(a) Conventional FR-4 PCB; (b) thermal-via PCB; (c) ceramic-metal PCB

Fig.3 Photo imaging of test set-up for measuring thermal resistance

Fig.4 Optical images of ceramic-metal LED packages.
(a) Under-sintering; (b) over-sintering; (c) optimized sintering

Fig.5 Ceramic-metal based 50 W LED array module after LED chip mounting.
(a) After top insulation layer coating; (b) before top insulation layer coating (inset)

Fig.6 Differential structure functions for types of LED one-chip LED test boards

Fig.7 Prototype 50 W LED down lighting system using ceramic-metal package

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