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Co-packaged optics (CPO): status, challenges, and solutions |
Min Tan1,2( ), Jiang Xu3,4,5(), Siyang Liu6, Junbo Feng6(), Hua Zhang7(), Chaonan Yao7, Shixi Chen3, Hangyu Guo8, Gengshi Han8, Zhanhao Wen8, Bao Chen8, Yu He8, Xuqiang Zheng8(), Da Ming1, Yaowen Tu1, Qiang Fu1, Nan Qi9, Dan Li10(), Li Geng10, Song Wen8, Fenghe Yang11, Huimin He8, Fengman Liu8, Haiyun Xue8(), Yuhang Wang1, Ciyuan Qiu12(), Guangcan Mi13, Yanbo Li13, Tianhai Chang13(), Mingche Lai14, Luo Zhang14(), Qinfen Hao15(), Mengyuan Qin15 |
1. School of Optical and Electronic Information, Huazhong University of Science and Technology, Wuhan 430074, China
2. Wuhan National Laboratory for Optoelectronics, Huazhong University of Science and Technology, Wuhan 430074, China
3. Department of Electronic and Computer Engineering, The Hong Kong University of Science and Technology, Hong Kong, China
4. HKUST Fok Ying Tung Research Institute, Guangzhou 511462, China
5. The Hong Kong University of Science and Technology(Guangzhou), Guangzhou 511462, China
6. Chongqing United Micro-Electronics Center(CUMEC), Chongqing 401332, China
7. Hisense Broadband Multimedia Technologies Co., Ltd., Qingdao 266000, China
8. Institute of Microelectronics, Chinese Academy of Sciences, Beijing 100029, China
9. State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
10. School of Microelectronics, Xi'an Jiaotong University, Xi'an 710049, China
11. Zhangjiang Laboratory, Shanghai 201210, China
12. The State Key Laboratory of Advanced Optical Communication Systems and Networks, Department of Electronic Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
13. Huawei Technologies Co., Ltd., Shenzhen 440307, China
14. College of Computer, National University of Defense Technology, Changsha 410073, China
15. Institute of Computing Technology, Chinese Academy of Sciences, Beijing 100086, China |
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Abstract Due to the rise of 5G, IoT, AI, and high-performance computing applications, datacenter traffic has grown at a compound annual growth rate of nearly 30%. Furthermore, nearly three-fourths of the datacenter traffic resides within datacenters. The conventional pluggable optics increases at a much slower rate than that of datacenter traffic. The gap between application requirements and the capability of conventional pluggable optics keeps increasing, a trend that is unsustainable. Copackaged optics (CPO) is a disruptive approach to increasing the interconnecting bandwidth density and energy efficiency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics. CPO is widely regarded as a promising solution for future datacenter interconnections, and silicon platform is the most promising platform for large-scale integration. Leading international companies (e.g., Intel, Broadcom and IBM) have heavily investigated in CPO technology, an inter-disciplinary research field that involves photonic devices, integrated circuits design, packaging, photonic device modeling, electronic-photonic co-simulation, applications, and standardization. This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform, identify the key challenges, and point out the potential solutions, hoping to encourage collaboration between different research fields to accelerate the development of CPO technology.
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| Keywords
Co-packaged optics
Silicon photonics
High-performance computing
Advanced packaging
External laser
Optical power delivery
Co-simulation
Standardization
Transmitter
Receiver
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Corresponding Author(s):
Min Tan,Jiang Xu,Junbo Feng,Hua Zhang,Xuqiang Zheng,Dan Li,Haiyun Xue,Ciyuan Qiu,Tianhai Chang,Luo Zhang,Qinfen Hao
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Issue Date: 20 April 2023
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