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Fabrication of an electronic package box of SiCP/Al composites with high volume SiCP |
| CHU Ke, JIA Chengchang, YIN Fazhang, MEI Xuezhen, QU Xuanhui |
| School of Materials Science and Technology, University of Science and Technology Beijing, Beijing 100083, China; |
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Abstract In this paper, a SiCP preform was prepared by Powder Injection Molding (PIM), and the melting aluminum was injected into the SiCP preform by the pressure infiltration method to manufacture an electronic package box of SiCP (65%)/Al composites. SiCP (65%)/Al composite prepared by pressure infiltration has full density and a homogeneous microstructure. The relative density of the composite is higher than 99%, the thermal expansion coefficient and thermal conductivity of the composite are 8.0?10 6/K and nearly 130 W/(m °K) at room temperature, respectively, which meet the requirements of electronic packaging.
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Issue Date: 05 June 2007
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