Fabrication of Cu/graphite film/Cu sandwich composites with ultrahigh thermal conductivity for thermal management applications

doi:10.1007/s11706-020-0503-y

Front. Mater. Sci.

2020, Vol. 14

Issue (2) : 188-197 https://doi.org/10.1007/s11706-020-0503-y

RESEARCH ARTICLE

Fabrication of Cu/graphite film/Cu sandwich composites with ultrahigh thermal conductivity for thermal management applications

Rui ZHAO¹, Weikai LI¹, Tian WANG¹, Ke ZHAN¹(

), Zheng YANG², Ya YAN¹, Bin ZHAO¹, Junhe YANG¹

¹. School of Materials Science and Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China
². School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China

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Abstract

Effective thermal management of electronic integrated devices with high powder density has become a serious issue, which requires materials with high thermal conductivity (TC). In order to solve the problem of weak bonding between graphite and Cu, a novel Cu/graphite film/Cu sandwich composite (Cu/GF/Cu composite) with ultrahigh TC was fabricated by electro-deposition. The micro-riveting structure was introduced to enhance the bonding strength between graphite film and deposited Cu layers by preparing a rectangular array of micro-holes on the graphite film before electro-deposition. TC and mechanical properties of the composites with different graphite volume fractions and current densities were investigated. The results showed that the TC enhancement generated by the micro-riveting structure for Cu/GF/Cu composites at low graphite content was more effective than that at high graphite content, and the strong texture orientation of deposited Cu resulted in high TC. Under the optimizing preparing condition, the highest in-plane TC reached 824.3 W·m⁻¹·K⁻¹, while the ultimate tensile strength of this composite was about four times higher than that of the graphite film.

Keywords metal matrix composites electro-deposition micro-riveting thermal conductivity graphite film

Corresponding Author(s): Ke ZHAN

Online First Date: 14 May 2020 Issue Date: 27 May 2020

Cite this article:

Rui ZHAO,Weikai LI,Tian WANG, et al. Fabrication of Cu/graphite film/Cu sandwich composites with ultrahigh thermal conductivity for thermal management applications[J]. Front. Mater. Sci., 2020, 14(2): 188-197.

URL:

https://academic.hep.com.cn/foms/EN/10.1007/s11706-020-0503-y
https://academic.hep.com.cn/foms/EN/Y2020/V14/I2/188

Fig.1 (a) XRD pattern of the graphite film (inset showing the flexible real sample). (b) Raman spectrum of the graphite film (inset showing its morphology).

Fig.2 Schematic of the preparation process of Cu/graphite film/Cu sandwich composites.

Fig.3 (a) XRD patterns of Cu/graphite film/Cu composites. (b) Variations of density and specific heat capacity with the graphite volume faction of Cu/graphite film/Cu composites.

Fig.4 (a)(d) Samples, (b)(e) surface morphology and (c)(f) cross-section morphology of Cu/graphite film/Cu composites (graphite volume faction 10%) without (upper) or with (lower) micro-riveting treatment.

Fig.5 (a) Thermal diffusivity values and (b) TC values of Cu/graphite film/Cu sandwich composites with different graphite contents.

Tab.1 Texture coefficients of Cu/graphite/Cu composites with 20 wt.% graphite content prepared at different current densities

Fig.6 (a) XRD patterns and (b) TC values of Cu/graphite/Cu composites with 20 wt.% graphite content prepared at different current densities.

Fig.7 Stress–strain curves of pure graphite and micro-riveted Cu/graphite/Cu sandwich composites with 38.5% graphite content.

Fig.8 (a) Comparison of TC values of Cu/graphite film/Cu sandwich composites with different graphite volume fractions to theoretical values calculated by the TC model of laminate composites. (b) Schematics of Cu/graphite film/Cu sandwich composites with different graphite contents. (c) Compared with other kinds of graphite reinforced thermal management composites fabricated in references.

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