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Frontiers of Physics

ISSN 2095-0462

ISSN 2095-0470(Online)

CN 11-5994/O4

邮发代号 80-965

2019 Impact Factor: 2.502

Frontiers of Physics  2013, Vol. 8 Issue (5): 491-508   https://doi.org/10.1007/s11467-013-0380-2
  REVIEW ARTICLE 本期目录
Electronic transport properties of topological insulator films and low dimensional superconductors
Electronic transport properties of topological insulator films and low dimensional superconductors
Ying Xing (邢颖)1, Yi Sun (孙祎)1, Meenakshi Singh2, Yan-Fei Zhao (赵弇斐)1, Moses H. W. Chan2, Jian Wang (王健)1,2()
1. International Center for Quantum Materials, School of Physics, Peking University, Beijing 100871, China; 2. The Center for Nanoscale Science and Department of Physics, The Pennsylvania State University, University Park, PA 16802-6300, USA
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Abstract

In this review, we present a summary of some recent experiments on topological insulators (TIs) and superconducting nanowires and films. Electron-electron interaction (EEI), weak anti-localization (WAL) and anisotropic magneto-resistance (AMR) effect found in topological insulator films by transport measurements are reported. Then, transport properties of superconducting films, bridges and nanowires and proximity effect in non-superconducting nanowires are described. Finally, the interplay between topological insulators and superconductors (SCs) is also discussed.

Key wordselectronic transport    topological insulator    superconductor    low dimensional
收稿日期: 2013-07-30      出版日期: 2013-10-01
Corresponding Author(s): Jian Wang (王健),Email:jianwangphysics@pku.edu.cn   
 引用本文:   
. Electronic transport properties of topological insulator films and low dimensional superconductors[J]. Frontiers of Physics, 2013, 8(5): 491-508.
Ying Xing (邢颖), Yi Sun (孙祎), Meenakshi Singh, Yan-Fei Zhao (赵弇斐), Moses H. W. Chan, Jian Wang (王健). Electronic transport properties of topological insulator films and low dimensional superconductors. Front. Phys. , 2013, 8(5): 491-508.
 链接本文:  
https://academic.hep.com.cn/fop/CN/10.1007/s11467-013-0380-2
https://academic.hep.com.cn/fop/CN/Y2013/V8/I5/491
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