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A novel hanging bowl-shaped mask for the fabrication of vertical sidewall structures |
Dongxue Chen1,2,Qian Liu1,*() |
1. National Center for Nanoscience and Technology, Beijing 100190, China
2. University of Chinese Academy of Sciences, Beijing 100080, China |
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Abstract Contact exposure is expected to occur in conventional lithography, and can be a source of process deviations (such as shrinking and distortion of templates) during reactive ion etching and inductively coupled plasma etching, as these deviations are induced by ion bombardment. This typically results in undesired sidewall effects, such as lower sidewall angles. Here we report a novel hanging bowlshaped lithography mask that can effectively minimize sidewall effects in lithography applications. As a test case, standard silicon carbide pillars with vertical sidewalls are fabricated using this mask. The mask could be used for fabrication of high-aspect-ratio structures with ultra-violet lithography.
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Keywords
UV lithography
hanging bowl-shaped mask
sidewall effects
ICP
SiC
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Fund: |
Corresponding Author(s):
Qian Liu
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Online First Date: 18 November 2015
Issue Date: 01 February 2016
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