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Frontiers of Environmental Science & Engineering

ISSN 2095-2201

ISSN 2095-221X(Online)

CN 10-1013/X

Postal Subscription Code 80-973

2018 Impact Factor: 3.883

Front Envir Sci Eng Chin    2011, Vol. 5 Issue (2) : 167-174    https://doi.org/10.1007/s11783-011-0308-4
RESEARCH ARTICLE
Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing
Yao CHEN1, Jinhui LI1(), Huabo DUAN1, Zhishi WANG2
1. School of Environment, Tsinghua University, Beijing 100084, China; 2. Faculty of Science and Technology, University of Macau, Macau 999078, China
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Abstract

Mechanical waste-processing methods, which combine crushing and separation processes for the recovery of valuable materials, have been widely applied in waste printed wiring board (PWB) treatment. However, both the high impact toughness and the tensile and flexural strengths of whole PWB with a laminated structure result in great energy consumption and severe abrasion of the cutters during multi-level crushing. In addition, the high temperatures occurring in continual crushing probably cause the decomposition of the polymer matrix. A thermal-crack method using residual steam as the heating medium has been developed to pre-treat waste PWBs. This treatment reduces the mechanical strength in order to improve the recovery rate of valuable materials in subsequent mechanical recycling. The changes of the PWBs’ macro-mechanical properties were studied to evaluate thermal expansion impacts associated with changes in temperature, and the dynamic dislocation micro-structures were observed to identify the fracture mechanism. The results showed that thermal cracking with steam at the temperature of 500 K can effectively attenuate the mechanical properties of waste PWBs, by reducing the impact, tensile and flexural strengths respectively, by 59.2%, 49.3% and 51.4%, compared to untreated PWB. Thermal expansion can also facilitate the separation of copper from glass fiber by reducing peel resistance by 95.4% at 500 K. It was revealed that the flexural fracture was a transverse cracking caused by concentrated stress when the heating temperature was less than 500 K, and shifted to a vertical cracking after exceeding 500 K.

Keywords waste printed wiring board (PWB)      residue steam      thermal-crack      mechanical properties     
Corresponding Author(s): LI Jinhui,Email:jinhui@tsinghua.edu.cn   
Issue Date: 05 June 2011
 Cite this article:   
Yao CHEN,Jinhui LI,Huabo DUAN, et al. Thermal cracking of waste printed wiring boards for mechanical recycling by using residual steam preprocessing[J]. Front Envir Sci Eng Chin, 2011, 5(2): 167-174.
 URL:  
https://academic.hep.com.cn/fese/EN/10.1007/s11783-011-0308-4
https://academic.hep.com.cn/fese/EN/Y2011/V5/I2/167
Fig.1  Multi-layer structure of FR-4-type PWB
Fig.2  Standard FR-4 samples for mechanical properties tests. (a) peel resistance; (b) tensile strength; (c) flexural strength; (d) impact strength
Fig.3  Flow chart of thermal cracks with steam
Fig.4  Micro-structures of the PWBs before and after thermal cracking. (a) untreated; (b) at 455 K; (c) at 500 K; (d) at 530 K
Fig.5  Influence of thermal cracking with steam on tensile and flexural strength
Fig.6  Influence of thermal cracking with steam on impact strength
Fig.7  Influence of thermal cracking with steam on peel resistance
Fig.8  Comparison of the attenuation effects of different thermal-crack atmospheres on PWBs’ (a) flexural strength; (b) peel resistance
Fig.9  Dynamic micro-structure dislocations of PWBs under three-point micro-bend tests: (a) untreated, ×40 and (b) untreated, ×350; (c) at 455 K with loading of 79 N and (d) at 455 K, fracture interface; (e) at 500 K, with loading of 40 N and (f) at 500 K, fracture interface; (g) at 530 K, ×60 and (h) at 530 K, ×500
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