A review of the scalable nano-manufacturing technology for flexible devices

doi:10.1007/s11465-017-0416-3

Frontiers of Mechanical Engineering

2017, Vol. 12

Issue (1): 99-109 https://doi.org/10.1007/s11465-017-0416-3

本期目录

A review of the scalable nano-manufacturing technology for flexible devices

Wenbin HUANG¹,Xingtao YU²,Yanhua LIU¹,Wen QIAO¹(

),Linsen CHEN¹

¹. College of Physics, Optoelectronics and Energy & Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, Suzhou 215006, China; Key Lab of Advanced Optical Manufacturing Technologies of Jiangsu Province & Key Lab of Modern Optical Technologies of Education Ministry of China, Soochow University, Suzhou 215006, China
². College of Physics, Optoelectronics and Energy & Collaborative Innovation Center of Suzhou Nano Science and Technology, Soochow University, Suzhou 215006, China

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Abstract：

Recent advances in electronic and photonic devices, such as artificial skin, wearable systems, organic and inorganic light-emitting diodes, have gained considerable commercial and scientific interest in the academe and in industries. However, low-cost and high-throughput nano-manufacturing is difficult to realize with the use of traditional photolithographic processes. In this review, we summarize the status and the limitations of current nano-patterning techniques for scalable and flexible functional devices in terms of working principle, resolution, and processing speed. Finally, several remaining unsolved problems in nano-manufacturing are discussed, and future research directions are highlighted.

Key words： flexible nano-manufacturing flexible devices nanofabrication scalability

收稿日期: 2016-08-24 出版日期: 2017-03-21

Corresponding Author(s): Wen QIAO

引用本文:

. [J]. Frontiers of Mechanical Engineering, 2017, 12(1): 99-109.
Wenbin HUANG,Xingtao YU,Yanhua LIU,Wen QIAO,Linsen CHEN. A review of the scalable nano-manufacturing technology for flexible devices. Front. Mech. Eng., 2017, 12(1): 99-109.

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https://academic.hep.com.cn/fme/CN/10.1007/s11465-017-0416-3
https://academic.hep.com.cn/fme/CN/Y2017/V12/I1/99

Nano-manufacturing technologies	Material compatibility	Resolution	Throughput	Equipment cost
Laser direct writing (LDW) [9]	Photoresist or deposition with precursor or ablation of absorbent materials	Low $λ$	High 0.2 m²/s	Medium Tens or hundreds of thousands of dollars
Dot-matrix holography [19–21]	Photoresist	Medium $λ 4$	Medium 0.002 m²/s	Medium Tens or hundreds of thousands of dollars
Interference lithography (IL) [6,22,23]	Photoresist or deposition with precursor or direct ablation of absorbent materials	Medium $λ 4$	Low Minutes/wafer (determined by the interference area)	Medium Tens or hundreds of thousands of dollars
Scanning probe lithography (SPN) [24]	Material modification, removal and deposition	5 nm	Low 10^-4 cm²/h	Medium Tens or hundreds of thousands of dollars
Directed self-assembly (DSA) [7,25–29]	Block copolymers	High 11 nm	Low Small areas (cm²) in hours in parallel	Extremely low No sophisticated equipment is required
Nano-imprinting Lithography [30–35]	Substrates with suitable surface energy	Depending on the mold	Extremely high 1 m²/s	Medium Tens or hundreds of thousands of dollars

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