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Frontiers of Mechanical Engineering

ISSN 2095-0233

ISSN 2095-0241(Online)

CN 11-5984/TH

Postal Subscription Code 80-975

2018 Impact Factor: 0.989

Front. Mech. Eng.    2008, Vol. 3 Issue (4) : 449-453    https://doi.org/10.1007/s11465-008-0076-4
Piezoelectric diffuser/nozzle micropump with double pump chambers
WANG Wei, ZHANG Ying, TIAN Li, CHEN Xiaojie, LIU Xiaowei
School of Mechtronics Engineering, Harbin Institute of Technology
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Abstract To eliminate check valve fatigue and valve clogging, diffuser/nozzle elements are used for flow rectification in a valveless diffuser/nozzle micropump instead of valves. However, the application of this type of micropump is restricted because of its pulsating or periodic flow and low pump flux. In this paper, a diffuser/nozzle Si/Glass micropump with two pump chambers by IC and MEMS technology is designed. The fabrication process requires only one mask and one etch step, so that the fabrication has the advantages of low cost, short processing period, and facilitation of miniaturization. The pump is equipped with a glass cover board so as to conveniently observe the flow status. Pump-chambers and diffuser elements are fabricated by the anisotropic KOH-etch technique on the silicone substrate, and the convex corner is designed to compensate for an anisotropic etch. The driving force of the micropump is produced by the PZT piezoelectric actuator. The pump performance with both actuators actuated in anti- or same-phase mode is also researched. The result indicates that the micropump achieves great performance with the actuators working at anti-phase. This may be because the liquid flows steadily, pulse phenomenon is very weak, and the optimal working frequency, pump back pressure, and flow rate are both double that of the pump driven in same-phase.
Issue Date: 05 December 2008
 Cite this article:   
WANG Wei,ZHANG Ying,TIAN Li, et al. Piezoelectric diffuser/nozzle micropump with double pump chambers[J]. Front. Mech. Eng., 2008, 3(4): 449-453.
 URL:  
https://academic.hep.com.cn/fme/EN/10.1007/s11465-008-0076-4
https://academic.hep.com.cn/fme/EN/Y2008/V3/I4/449
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