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Frontiers of Mechanical Engineering

ISSN 2095-0233

ISSN 2095-0241(Online)

CN 11-5984/TH

Postal Subscription Code 80-975

2018 Impact Factor: 0.989

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Front Mech Eng Chin    0, Vol. Issue () : 184-191    https://doi.org/10.1007/s11465-009-0034-9
RESEARCH ARTICLE
Research and application of visual location technology for solder paste printing based on machine vision
Luosi WEI(), Zongxia JIAO
School of Automation Science and Electrical Engineering, Beihang University, Beijing 100191, China
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Abstract

A location system is very important for solder paste printing in the process of surface mount technology (SMT). Using machine vision technology to complete the location mission is new and very efficient. This paper presents an integrated visual location system for solder paste printing based on machine vision. The working principle of solder paste printing is introduced and then the design and implementation of the visual location system are described. In the system, two key techniques are completed by secondary development based on VisionPro. One is accurate image location solved by the pattern-based location algorithms of PatMax. The other one is camera calibration that is achieved by image warping technology through the checkerboard plate. Moreover, the system can provide good performances such as high image locating accuracy with 1/40 sub-pixels, high anti-jamming, and high-speed location of objects whose appearance is rotated, scaled, and/or stretched.
Keywords machine vision      visual location      solder paste printing      VisionPro     
Corresponding Author(s): WEI Luosi,Email:weiluosi@hotmail.com   
Issue Date: 05 June 2009
 Cite this article:   
Luosi WEI,Zongxia JIAO. Research and application of visual location technology for solder paste printing based on machine vision[J]. Front Mech Eng Chin, 0, (): 184-191.
 URL:  
https://academic.hep.com.cn/fme/EN/10.1007/s11465-009-0034-9
https://academic.hep.com.cn/fme/EN/Y0/V/I/184
Fig.1  Printing process of solder paste printing. (a) Align; (b) print ready; (c) printing; (d) separate; (e) printed
Fig.2  Structure principle of the location system
1 squeegee; 2 stencil; 3 camera module position; 4 compensation between PCB and stencil; 5 PCB Z motion; 6 PCB support; 7 vacuum pins; 8 -- driven mechanis; 9 PCB marks; 10 PCB; 11 camera - transport; 12 camera module position ; 13 stencil marks
Fig.3  Coordinate transformation from PCB to stencil
Fig.4  Hardware structure of visual location system
Fig.5  Scheme of single camera
Fig.6  Scheme of two cameras
Fig.7  Flow chart of visual location software system
Fig.8  Non-linear distortions. (a) Planar perspective distortion; (b) radial distortion
Fig.9  Cheakborad palte
Fig.10  Correct barrel nonlinear distortion using image warping
Fig.11  Structure of camera module adjustment
Fig.12  Pattern-location technology
Fig.13  Flow chart of image location
parametersoriginpolarityelasticitygranularity
settingcenterconsiderclose to 0.0finer
Tab.1  Settings of PatMax parameters
Fig.14  Implementation of the visual location system
Fig.15  Image location testing of cross fiducial mark. (a) Train pattern; (b) run-time: be shifted; (c) run-time: anti-jamming; (d) run-time: be rotated; (e) run-time : be scaled; (f) run-time: be stretched
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