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Frontiers of Mechanical Engineering

ISSN 2095-0233

ISSN 2095-0241(Online)

CN 11-5984/TH

Postal Subscription Code 80-975

2018 Impact Factor: 0.989

Front. Mech. Eng.    2015, Vol. 10 Issue (2) : 126-137    https://doi.org/10.1007/s11465-015-0340-3
RESEARCH ARTICLE
An identification method for enclosed voids restriction in manufacturability design for additive manufacturing structures
Shutian LIU1,*(),Quhao LI1,Wenjiong CHEN1,Liyong TONG1,2,Gengdong CHENG1
1. State Key Laboratory of Structural Analysis for Industrial Equipment, Dalian University of Technology, Dalian 116024, China
2. School of Aerospace, Mechanical and Mechatronic Engineering, University of Sydney, NSW 2006, Australia
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Abstract

Additive manufacturing (AM) technologies, such as selective laser sintering (SLS) and fused deposition modeling (FDM), have become the powerful tools for direct manufacturing of complex parts. This breakthrough in manufacturing technology makes the fabrication of new geometrical features and multiple materials possible. Past researches on designs and design methods often focused on how to obtain desired functional performance of the structures or parts, specific manufacturing capabilities as well as manufacturing constraints of AM were neglected. However, the inherent constraints in AM processes should be taken into account in design process. In this paper, the enclosed voids, one type of manufacturing constraints of AM, are investigated. In mathematics, enclosed voids restriction expressed as the solid structure is simply-connected. We propose an equivalent description of simply-connected constraint for avoiding enclosed voids in structures, named as virtual temperature method (VTM). In this method, suppose that the voids in structure are filled with a virtual heating material with high heat conductivity and solid areas are filled with another virtual material with low heat conductivity. Once the enclosed voids exist in structure, the maximum temperature value of structure will be very high. Based upon this method, the simply-connected constraint is equivalent to maximum temperature constraint. And this method can be easily used to formulate the simply-connected constraint in topology optimization. The effectiveness of this description method is illustrated by several examples. Based upon topology optimization, an example of 3D cantilever beam is used to illustrate the trade-off between manufacturability and functionality. Moreover, the three optimized structures are fabricated by FDM technology to indicate further the necessity of considering the simply-connected constraint in design phase for AM.

Keywords additive manufacturing, topology optimization, manufacturability constraints, design for additive manufacturing, simply-connected constraint     
Corresponding Author(s): Shutian LIU   
Online First Date: 24 June 2015    Issue Date: 14 July 2015
 Cite this article:   
Shutian LIU,Quhao LI,Wenjiong CHEN, et al. An identification method for enclosed voids restriction in manufacturability design for additive manufacturing structures[J]. Front. Mech. Eng., 2015, 10(2): 126-137.
 URL:  
https://academic.hep.com.cn/fme/EN/10.1007/s11465-015-0340-3
https://academic.hep.com.cn/fme/EN/Y2015/V10/I2/126
Fig.1  Examples of connected structure. (a) Simply-connected structure; (b) multiply-connected structure
Fig.2  Illustration of the background mesh. (a) Simply-connected structure; (b) multiply-connected structure
Fig.3  Illustration of vertex and edge
Fig.4  Virtual temperature method for two different structures. (a) Multiply-connected structure; (b) simply-connected structure
Topology Material property Heat source
ρ e = 0 (i.e., void) High heat conductive material Yes
ρ e = 1 (i.e., solid) Thermal insulation material No
Tab.1  Characteristic of the virtual temperature model
Fig.5  Finite element model. (a) Simply-connected structure; (b) multiply-connected structure
Fig.6  The temperature field for the two structures in Fig. 5. (a) Simply-connected structure; (b) multiply-connected structure
No. Structure Maximum temperature
1 352261.0
2 284828.0
3 117546.0
4 50663.6
Tab.2  Maximum temperature of some multiply-connected structures
No. Structure Maximum temperature
7 0.5000
8 15.6692
9 17.9989
10 706.0760
Tab.3  Maximum temperature of some simply-connected structures
Fig.15  Maximum temperatures of all above structures
Fig.16  The design problem of 3D cantilever supported beam
Fig.17  The optimized topology without manufacturing process constraints. (a) The optimal structure; (b) the profile of structure (the red part is solid and the blue part is void)
Fig.18  The optimized topology considering connectivity process constraints with T ˉ = 10 T max ? . (a) The optimal structure; (b) the profile of structure (the red part is solid and the blue part is void)
Fig.19  The optimized topology considering connectivity process constraints with T ˉ = 6 T max ? . (a) The optimal structure; (b) the profile of structure (the red part is solid and the blue part is void)
Fig.20  The CAD model of the three optimized structure. (a) Model without manufacturing process constraints; (b) model considering connectivity process constraints with T ˉ = 10 T max ? ; (c) model considering connectivity process constraints with T ˉ = 6 T max ?
Fig.21  The real objects of the three models fabricated by FDM technology. (a) Model without manufacturing process constraints, the left bottom picture shows the profile of the structure; (b) model considering connectivity process constraints with T ˉ = 10 T max ? ; (c) model considering connectivity process constraints with T ˉ = 6 T max ?
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