Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions

doi:10.1007/s11465-019-0562-x

Front. Mech. Eng.

2020, Vol. 15

Issue (2) : 303-318 https://doi.org/10.1007/s11465-019-0562-x

RESEARCH ARTICLE

Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions

Juan Carlos HERNANDEZ-CASTANEDA¹, Boon Keng LOK¹, Hongyu ZHENG²(

)

¹. Singapore Institute of Manufacturing Technology, Singapore 138634, Singapore
². School of Mechanical Engineering, Shandong University of Technology, Zibo 255049, China

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Abstract

This study explores the feasibility of different laser systems to sinter screen-printed lines from nonconductive copper nanoparticles (Cu NPs) on polyethylene terephthalate polymer film. These materials are commonly used in manufacturing functional printed electronics for large-area applications. Here, optical and thermal characterization of the materials is conducted to identify suitable laser sources and process conditions. Direct diode (808 nm), Nd:YAG (1064 nm and second harmonic of 532 nm), and ytterbium fiber (1070 nm) lasers are explored. Optimal parameters for sintering the Cu NPs are identified for each laser system, which targets low resistivity and high processing speed. Finally, the quality of the sintered tracks is quantified, and the laser sintering mechanisms observed under different wavelengths are analyzed. Practical considerations are discussed to improve the laser sintering process of Cu NPs.

Keywords laser sintering copper nanoparticles printed electronics

Corresponding Author(s): Hongyu ZHENG

Just Accepted Date: 02 December 2019 Online First Date: 20 December 2019 Issue Date: 25 May 2020

Cite this article:

Juan Carlos HERNANDEZ-CASTANEDA,Boon Keng LOK,Hongyu ZHENG. Laser sintering of Cu nanoparticles on PET polymer substrate for printed electronics at different wavelengths and process conditions[J]. Front. Mech. Eng., 2020, 15(2): 303-318.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-019-0562-x
https://academic.hep.com.cn/fme/EN/Y2020/V15/I2/303

Fig.1 TEM image of the Cu NPs used in the experimental work. The analyzed sample has an average diameter of (16.35±2.6) nm, and the capping monolayer thickness is approximately 5.33 nm.

Fig.2 Optical absorbance for the wavelengths of the tested lasers of Cu NPs printed on the PET flexible polymer film.

Fig.3 Optical properties of the PET polymer film: (a) Transmittance and reflectance; (b) absorbance. The wavelengths of the tested laser system are indicated for reference.

Fig.4 Thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC) of the investigated Cu NPs paste.

Fig.5 (a) Differential scanning calorimetry (DSC) analysis of PET film; (b) thermogravimetric analysis (TGA) of PET polymer film.

Fig.6 Scanning patterns used in the laser sintering of Cu NP paste by the Nd:YAG (SH) picosecond laser system.

Fig.7 Electrical resistance of Cu NPs sintered by Nd:YAG laser (l = 532 nm, t = 10 ps) under different (a) laser average power levels and (b) total linear traverse speeds.

Fig.8 Optical and SEM photographs of Cu NPs sintered by Nd:YAG (SH, l = 532 nm, t = 10 ps) laser with (a) cross and (b) angled scanning patterns.

Fig.9 EDX of dried and laser-sintered Cu NPs by Nd:YAG (SH, l = 532 nm, t = 10 ps) after (a) drying and (b) laser sintering.

Fig.10 (a) Optical and (b) SEM photographs of Cu NPs sintered by diode laser (l = 808 nm, cw) in single scanning pass.

Fig.11 (a) Optical and (b) SEM photographs of Cu NPs sintered by Nd:YAG laser (l = 1064 nm, t = 38 ns) with a single pass.

Fig.12 (a) Optical and (b) SEM photographs of Cu NPs sintered by Yb fiber laser (l = 1070 nm, t = 38 ns) following a single scanning pass.

Fig.13 Electrical resistance of Cu NPs sintered by different lasers with different wavelengths and pulse modes.

Tab.1 Key characteristics of Cu NPs screen printed on PET polymer substrate sintered by four industrial laser systems with different wavelengths and pulse durations. Applied process condition and calculated optical absorption at room temperature

Fig.14 Resistivity and laser fluence in optimal conditions for the laser sintering of Cu NPs at different wavelengths and pulse modes.

No.	Focal spot	Average power/W	Spot diameter/cm	Speed/(m?min^–1)	Laser fluence/(J?cm^–2)	Power density/(W?cm^–2)	Length of line/cm	Interaction time/s	Resistance/W	Pattern
1	–3.0	2.310	0.01739	21.75	1.833	9729.10	1	0.0276	10.2	Angled
2	–3.0	2.145	0.01739	21.00	1.762	9034.17	1	0.0286	5.4	Angled
3	–3.0	2.970	0.01739	23.40	2.628	12508.85	1	0.0256	3.3	Angled
4	–3.0	2.937	0.01739	23.44	2.703	12369.86	1	0.0256	1.7	Angled
5	–3.0	2.970	0.01739	21.60	2.847	12508.85	1	0.0278	1.5	Angled
6	–3.0	2.937	0.01739	22.50	2.815	12369.86	1	0.0267	1.3	Angled
7	–3.0	2.904	0.01739	18.86	3.037	12230.87	1	0.0318	1.2	Angled
8	–3.0	2.904	0.01739	19.69	3.181	12230.87	1	0.0305	2.6	Angled
9	–3.0	2.904	0.01739	18.00	3.181	12230.87	1	0.0333	1.1	Angled
10	–3.0	2.838	0.01739	18.00	3.109	11952.90	1	0.0333	1.2	Angled
11	–3.0	2.640	0.01739	20.80	2.920	11118.97	1	0.0288	1.9	Angled
12	–3.0	2.904	0.01739	16.20	3.275	12230.87	1	0.0370	1.3	Angled
13	–3.0	2.904	0.01739	15.00	3.340	12230.87	1	0.0400	1.1	Angled
14	–3.0	2.805	0.01739	14.35	3.227	11813.91	1	0.0418	13.6	Angled
15	–3.0	2.640	0.01739	20.00	3.037	11118.97	1	0.0300	2.1	Angled
16	–3.0	2.574	0.01739	20.27	2.961	10841.00	1	0.0296	1.9	Angled
17	–3.0	2.838	0.01739	17.14	3.265	11952.90	1	0.0350	1.1	Angled
18	–2.5	2.442	0.01451	12.00	4.206	14760.45	1	0.0500	1.9	Angled
19	–2.0	1.914	0.01165	9.00	5.478	17965.17	1	0.0667	1.9	Angled
20	–2.0	1.254	0.01165	5.33	5.383	11770.28	1	0.1125	3.2	Angled
21	–2.0	1.089	0.01165	5.07	4.921	10221.56	1	0.1184	7.1	Angled
22	–2.0	1.089	0.01165	4.80	5.195	10221.56	1	0.1250	2.6	Angled
23	–2.0	1.089	0.01165	4.53	5.500	10221.56	1	0.1324	2.4	Angled
24	–2.0	0.726	0.01165	5.54	4.156	6814.38	1	0.1083	2.7	Angled
25	–3.0	2.508	0.01739	12.40	2.327	10563.03	1	0.0484	16.0	Cross
26	–3.0	2.498	0.01739	12.20	2.355	10521.33	1	0.0492	1.9	Cross
27	–3.0	2.482	0.01739	12.00	2.379	10451.84	1	0.0500	3.2	Cross
28	–3.0	2.482	0.01739	12.00	2.379	10453.52	1	0.0500	1.8	Cross
29	–3.0	0.759	0.01739	2.77	2.910	3196.71	1	0.2167	3.0	Cross
30	–3.0	0.759	0.01739	2.77	2.910	3196.71	1	0.2167	4.1	Cross
31	–2.0	1.056	0.01165	4.53	3.297	9911.82	1	0.1324	3.7	Cross
32	–2.0	1.089	0.01165	3.15	3.667	10221.56	1	0.1905	2.6	Cross
33	–2.0	1.056	0.01165	3.75	3.627	9911.82	1	0.1600	2.0	Cross
34	–2.0	1.056	0.01165	3.09	3.627	9911.82	1	0.1943	2.5	Cross
35	–2.0	1.089	0.01165	3.45	4.065	10221.56	1	0.1739	3.8	Cross
36	–2.0	1.056	0.01165	3.69	4.533	9911.82	1	0.1625	1.5	Cross
37	–2.0	0.990	0.01165	3.51	4.474	9292.33	1	0.1711	1.7	Cross
38	–2.0	0.924	0.01165	3.32	4.407	8672.84	1	0.1806	1.5	Cross
39	–2.0	0.858	0.01165	3.14	4.333	8053.35	1	0.1912	1.6	Cross
40	–2.0	0.825	0.01165	2.95	4.427	7743.61	1	0.2031	1.5	Cross
41	–2.0	0.792	0.01165	2.86	4.387	7433.86	1	0.2097	4.0	Cross
42	–2.0	0.759	0.01165	2.77	4.345	7124.12	1	0.2167	1.9	Cross

Table A1 Process parameters investigated in the sintering by a Time Bandwidth Duetto Nd:YAG laser SH (l = 532 nm, t = 10 ps) of Cu NP ink printed on the PET polymer film

Table A2 Process parameters investigated in the sintering by a coherent FAP diode laser (808 nm) of Cu NP ink printed on the PET polymer film

Table A3 Process parameters investigated in the sintering by a ROFIN DQ x50S Nd:YAG laser (l = 1064 nm, t = 38 ns) of Cu NP ink printed on the PET polymer film

Table A4 Process parameters investigated in the sintering by SPI ytterbium laser (l = 1070 nm, cw) of Cu NP ink printed on the PET film

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