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Frontiers of Optoelectronics

ISSN 2095-2759

ISSN 2095-2767(Online)

CN 10-1029/TN

Postal Subscription Code 80-976

Front Optoelec    2013, Vol. 6 Issue (3) : 327-337    https://doi.org/10.1007/s12200-013-0328-8
RESEARCH ARTICLE
Ground bounce noise reduction aware combinational multi threshold CMOS circuits for nanoscale CMOS multiplier
Bipin Kumar VERMA(), Shyam Babu SINGH(), Shyam AKASHE()
Department of Electronics and Communication Engineering, ITM University, Gwalior (M.P.) 474001, India
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Abstract

Multi-threshold complementary metal-oxide-semiconductor (MTCMOS) is often used to reduce the leakage current in idle circuit. Ground bounce noise produced during a transition mode (sleep-to-active) is an important challenge in MTCMOS. In this paper, various noise-aware combinational MTCMOS circuit was used to evaluate the ground bounce noise. An intermediate mode was applied in the sleep-to-active mode transition to reduce the charge stored on virtual lines to real ground. The dependence of ground bounce noise on voltage, transistor size and temperature was investigated with different MTCMOS circuit technique. The peak amplitude of ground bounce noise was reduced up to 78.82%. The leakage current of the circuit was decreased up to 99.73% and the active power of the circuit was reduced up to 62.32%. Simulation of multiplier with different MTCMOS circuit techniques was performed on 45 nm CMOS technology.

Keywords multi-threshold complementary metal-oxide-semiconductor (MTCMOS)      mode transition      ground bounce noise      sleep transistor     
Corresponding Author(s): VERMA Bipin Kumar,Email:bipinverma05@gmail.com; SINGH Shyam Babu,Email:itm.shyam@gmail.com; AKASHE Shyam,Email:shyam.akashe@yahoo.com   
Issue Date: 05 September 2013
 Cite this article:   
Shyam AKASHE,Bipin Kumar VERMA,Shyam Babu SINGH. Ground bounce noise reduction aware combinational multi threshold CMOS circuits for nanoscale CMOS multiplier[J]. Front Optoelec, 2013, 6(3): 327-337.
 URL:  
https://academic.hep.com.cn/foe/EN/10.1007/s12200-013-0328-8
https://academic.hep.com.cn/foe/EN/Y2013/V6/I3/327
Fig.1  Power and ground bounce noise generated in conventional MTCMOS technique on multiplier circuit
Fig.2  Basic operation of multiplier
Fig.3  Design of 4 × 4 bit-array multiplier (HA=half adder, FA=full adder)
Fig.4  Tri-mode MTCMOS technique [].
Fig.5  Dual-switch MTCMOS technique []. High-TH sleep transistors are represented by thick channel length. 0 V<MIN<DD
Fig.6  Tri-transistor-controlled MTCMOS circuit. (a) TTH; (b) TTL []. High-TH sleep transistors are represented by thick channel length. 0 V<MIN<DD
Fig.7  DIP-40 package pin ground bounce noise model
voltages
0.7 V0.9 V1 V
transistor size /nm2.6710152.6710152.671015
conventional2.1494.1563.511
tri-mode0.1220.1250.1271.2991.31.2862.6162.5932.51
dual switch0.1170.1150.1150.8830.8760.8901.6281.621.603
TTH0.1150.1130.1120.8790.8920.8951.6291.6141.624
TTL0.1120.1110.1100.8740.9050.9011.6251.6171.614
Tab.1  Effect of voltage scaling on ground bounce noise (unit: mV)
Fig.8  Percentage ground bounces noise reduction provided by different MTCMOS circuit techniques as compared to conventional circuit.
Fig.9  Waveform showing ground bounce noise at real ground (0.9 V and / = 2.67 nm). (a) Conventional design; (b) tri-mode design; (c) dual-switch design; (d) TTH; (e) TTL
Fig.10  Waveform of virtual ground line voltage of TTH circuit during transitions from sleep-to-active mode through doze mode. The duration of doze mode is 87.41 ns. (a) Virtual ground line voltage with small doze (dozer = 2.67 nm); (b) virtual ground line voltage with larger doze (dozer = 15 nm)
transistor size
2.67 nm10 nm15 nm20 nm
tri–mode88.5620.5152.4564.57
dual–switch133.8237.5328.4727.68
TTH87.4122.9825.3239.45
TTL79.6625.6730.7438.46
Tab.2  Relaxation time for different circuits (unit: ns)
Fig.11  Waveform of real ground voltage of TTH circuit during transitions from the sleep-to-active mode through doze mode. The duration of doze mode is 87.41 ns. (a) Ground bounce noise on real ground with smaller doze (dozer = 2.67 nm). (b) ground bounce noise on real ground with larger doze (dozer = 15 nm)
transistor size
2.67 nm10 nm15 nm20 nm
conventional4.156
tri-mode 1.2991.31.2861.265
dual-switch0.8830.8760.8900.883
TTH 0.8790.8920.8950.893
TTL 0.8740.9050.9010.899
Tab.3  Effect of transistor size on ground bounce noise (unit: mV)
Fig.12  Peak amplitude of ground bounces noise for tri-mode, dual-switch, TTH and TTL at different temperatures
temperature
27°C110°C
voltage/V0.70.910.70.91
conventional4761182502774742841411621475
Tri-mode27.8648.4289.0727.4353.3392.46
dual-switch43.7347.9749.7242.7247.3549.71
TTH 43.9448.1550.1943.1447.8150.03
TTL 48.9653.1555.3250.9256.3158.81
Tab.4  Leakage current consumption (unit: nA)
Fig.13  Percentage leakage current reduction provided by different MTCMOS circuit techniques as compared to conventional circuit (sleep mode)
transistor size
2.67 nm10 nm15 nm
conventional74.03
tri-mode27.8927.9327.94
dual-switch41.4141.8441.67
TTH41.8741.7741.87
TTL41.6541.8341.95
Tab.5  Active power consumption (unit: mW)
primary design metricbest techniqueworst technique
ground bounce noisevoltage scalingTTLtri-mode
transistor sizedual-switchtri-mode
temperatureTTLtri-mode
leakage current27°C, 0.7 Vtri-modeTTL
27°C, 0.9 V or 1 Vdual-switchtri-mode
active power consumptiontri-modeTTL
Tab.6  Performance comparison of different MTCMOS circuits
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