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Electrochemistry during efficient copper recovery from complex electronic waste using ammonia based solutions |
Zhi Sun1,2( ), Hongbin Cao2, Prakash Venkatesan1, Wei Jin2( ), Yanping Xiao3, Jilt Sietsma1, Yongxiang Yang1 |
1. Department of Materials Science and Engineering, TU Delft, 2628 CD Delft, the Netherlands 2. National Engineering Laboratory for Hydrometallurgical Cleaner Production Technology, Institute of Process Engineering, Chinese Academy of Sciences, Beijing 100190, China 3. Ironmaking Department, R&D, Tata Steel, 1970 CA IJmuiden, the Netherlands |
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Abstract Leaching selectivity during metal recovery from complex electronic waste using a hydrochemical process is always one of the generic issues. It was recently improved by using ammonia-based leaching process, specifically for electronic waste enriched with copper. This research proposes electrodeposition as the subsequent approach to effectively recover copper from the solutions after selective leaching of the electronic waste and focuses on recognising the electrochemical features of copper recovery. The electrochemical reactions were investigated by considering the effects of copper concentration, scan rate and ammonium salts. The diffusion coefficient, charge transfer coefficient and heterogeneous reaction constant of the electrodeposition process were evaluated in accordance with different solution conditions. The results have shown that electrochemical recovery of copper from ammonia-based solution under the conditions of selective electronic waste treatment is charge transfer controlled and provide bases to correlate the kinetic parameters with further optimisation of the selective recovery of metals from electronic waste.
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Keywords
copper recovery
electronic waste
end-of-life products
selective leaching
electrodeposition
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Corresponding Author(s):
Zhi Sun,Wei Jin
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Just Accepted Date: 26 August 2016
Online First Date: 12 September 2016
Issue Date: 23 August 2017
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1 |
Omar H, Rohani S. Treatment of landfill waste, leachate and landfill gas: A review. Frontiers of Chemical Science and Engineering, 2015, 9(1): 15–32
https://doi.org/10.1007/s11705-015-1501-y
|
2 |
Bigum M, Brogaard L, Christensen T H . Metal recovery from high-grade WEEE: A life cycle assessment. Journal of Hazardous Materials, 2012, 207-208(1): 8–14
https://doi.org/10.1016/j.jhazmat.2011.10.001
|
3 |
Anindya A. Minor elements distribution during the smelting of WEEE with copper scrap. Dissertation for the Doctoral Degree. Melbourne: RMIT University, 2012
|
4 |
Montero R, Guevara A, de la Torre E. Recovery of gold, silver, copper and niobium from printed circuit boards using leaching column. Journal of Earth Science and Engineering, 2012, 2: 590–595
|
5 |
Liang G, Tang J, Liu W , Zhou Q. Optimizing mixed culture of two acidophiles to improve copper recovery from printed circuit boards (PCBs). Journal of Hazardous Materials, 2013, 250-251: 238–245
https://doi.org/10.1016/j.jhazmat.2013.01.077
|
6 |
Joda N N, Rashchi F. Recovery of ultra fine grained silver and copper from PC board scraps. Separation and Purification Technology, 2012, 92: 36–42
https://doi.org/10.1016/j.seppur.2012.03.022
|
7 |
Rudnik E, Kołczyk K, Kutyła D . Comparative studies on hydrometallurgical treatment of smelted low-grade electronic scraps for selective copper recovery. Transactions of Nonferrous Metals Society of China, 2015, 25(8): 2763–2771
https://doi.org/10.1016/S1003-6326(15)63901-2
|
8 |
Harris G B, White C W, Demopoulos G P, Ballantyne B. Recovery of copper from a massive polymetallic sulphide by high concentration chloride leaching. Canadian Metallurgical Quarterly, 2008, 47(3): 347–356
https://doi.org/10.1179/cmq.2008.47.3.347
|
9 |
Long L H, Jeong J, Lee J C , Pandey B D , Yoo J M , Huyunh T H . Hydrometallurgical process for copper recovery from waste printed circuit boards (PCBs). Mineral Processing and Extractive Metallurgy Review, 2011, 32(2): 90–104
https://doi.org/10.1080/08827508.2010.530720
|
10 |
Koyama K, Tanaka M, Lee J C . Copper leaching behavior from waste printed circuit board in ammoniacal alkaline solution. Materials Transactions, 2006, 47(7): 1788–1792
https://doi.org/10.2320/matertrans.47.1788
|
11 |
Sun Z H I , Xiao Y, Sietsma J, Agterhuis H , Visser G , Yang Y. Selective copper recovery from complex mixtures of end-of-life electronic products with ammonia-based solution. Hydrometallurgy, 2015, 152: 91–99
https://doi.org/10.1016/j.hydromet.2014.12.013
|
12 |
Wang J, Wang H, Han Z , Han J. Electrodeposited porous Pb electrode with improved electrocatalytic performance for the electroreduction of CO2 to formic acid. Frontiers of Chemical Science and Engineering, 2015, 9(1): 57–63
https://doi.org/10.1007/s11705-014-1444-8
|
13 |
Nila C, González I. The role of pH and Cu(II) concentration in the electrodeposition of Cu(II) in NH4Cl solutions. Journal of Electroanalytical Chemistry, 1996, 401(1-2): 171–182
https://doi.org/10.1016/0022-0728(95)04278-4
|
14 |
Ramos A, Miranda-Hernández M, González I . Influence of chloride and nitrate anions on copper electrodeposition in ammonia media. Journal of the Electrochemical Society, 2001, 148(4): C315–C321
https://doi.org/10.1149/1.1357176
|
15 |
Grujicic D, Pesic B. Reaction and nucleation mechanisms of copper electrodeposition from ammoniacal solutions on vitreous carbon. Electrochimica Acta, 2005, 50(22): 4426–4443
https://doi.org/10.1016/j.electacta.2005.02.012
|
16 |
Schlesinger M, Paunovic M. Fundamentals of Electrochemical Deposition. Hobken: Wiley, 2006
|
17 |
Jankovic A, Dundar H, Mehta R . Relationships between comminution energy and product size for a magnetite ore. Journal of the South African Institute of Mining and Metallurgy, 2010, 110(3): 141–146
|
18 |
Xiao Y, Yang Y, van den Berg J, Sietsma J , Agterhuis H , Visser G , Bol D. Hydrometallurgical recovery of copper from complex mixtures of end-of-life shredded ICT products. Hydrometallurgy, 2013, 140: 128–134
https://doi.org/10.1016/j.hydromet.2013.09.012
|
19 |
Sun Z, Xiao Y, Sietsma J , Agterhuis H , Yang Y. A cleaner process for selective recovery of valuable metals from electronic waste of complex mixtures of end-of-life electronic products. Environmental Science & Technology, 2015, 49(13): 7981–7988
https://doi.org/10.1021/acs.est.5b01023
|
20 |
Meng X, Han K N. The principles and applications of ammonia leaching of metals—A review. Mineral Processing and Extractive Metallurgy Review, 1996, 16(1): 23–61
https://doi.org/10.1080/08827509608914128
|
21 |
Birdi K. Handbook of Surface and Colloid Chemistry. Boca Raton: CRC Press, 2002
|
22 |
Majidi M, Asadpour-Zeynali K, Hafezi B . Reaction and nucleation mechanisms of copper electrodeposition on disposable pencil graphite electrode. Electrochimica Acta, 2009, 54(3): 1119–1126
https://doi.org/10.1016/j.electacta.2008.08.035
|
23 |
Grujicic D, Pesic B. Electrodeposition of copper: The nucleation mechanisms. Electrochimica Acta, 2002, 47(18): 2901–2912
https://doi.org/10.1016/S0013-4686(02)00161-5
|
24 |
Darchen A, Drissi-Daoudi R, Irzho A . Electrochemical investigations of copper etching by Cu(NH3)4Cl2 in ammoniacal solutions. Journal of Applied Electrochemistry, 1997, 27(4): 448–454
https://doi.org/10.1023/A:1018469805966
|
25 |
Khattab I A, Shaffei M F, Shaaban N A, Hussein H S, Abd El-Rehim S S. Study the kinetics of electrochemical removal of copper from dilute solutions using packed bed electrode. Egyptian Journal of Petroleum, 2014, 23(1): 93–103
https://doi.org/10.1016/j.ejpe.2014.02.013
|
26 |
Viswanatha S, George S. Electrowinning of copper powder from copper sulphate solution in presence of glycerol and sulphuric acid. Indian Journal of Chemical Technology, 2011, 18(1): 37–44
|
27 |
Zoski C G. Handbook of Electrochemistry. Amsterdam: Elsevier, 2006
|
28 |
Katayama Y, Dan S, Miura T , Kishi T . Electrochemical behavior of silver in 1-ethyl-3-methylimidazolium tetrafluoroborate molten salt. Journal of the Electrochemical Society, 2001, 148(2): C102–C105
https://doi.org/10.1149/1.1341243
|
29 |
Mahmudul H M, Elius H M, Mamun M A, Ehsan M Q. Study of redox behavior of Cd(II) and interaction of Cd(II) with proline in the aqueous medium using cyclic voltammetry. Journal of Saudi Chemical Society, 2012, 16(2): 145–151
https://doi.org/10.1016/j.jscs.2011.06.006
|
30 |
Hinatsu J, Foulkes F. Electrochemical kinetic parameters for the cathodic deposition of copper from dilute aqueous acid sulfate solutions. Canadian Journal of Chemical Engineering, 1991, 69(2): 571–577
https://doi.org/10.1002/cjce.5450690224
|
31 |
Bard A J, Faulkner L R. Electrochemical methods: Fundamentals and applications. New York: Wiley, 1980
|
32 |
,IbañezA, Fatas E. Mechanical and structural properties of electrodeposited copper and their relation with the electrodeposition parameters. Surface and Coatings Technology, 2005, 191(1): 7–16
https://doi.org/10.1016/j.surfcoat.2004.05.001
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