Development of new transient liquid phase system Au-Sn-Au for microsystem technology

doi:10.1007/s11465-010-0107-9

Front Mech Eng Chin

2010, Vol. 5

Issue (4) : 370-375 https://doi.org/10.1007/s11465-010-0107-9

RESEARCH ARTICLE

Development of new transient liquid phase system Au-Sn-Au for microsystem technology

Kirsten BOBZIN, Nazlim BAGCIVAN, Lidong ZHAO, Stefania FERRARA, Jan PERNE(

)

Surface Engineering Institute, RWTH Aachen University, Augustinerbach 4-22, 52062 Aachen, Germany

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Abstract

In the last decade, microsystems evolved to decisive technology in many technical applications. With increasing requirements on the performance of microsystems, more and more dissimilar materials are used in the same assembly. Correspondingly, suitable joining methods are required to fulfil the requirements on good properties of joints. In this study, a new transient liquid phase (TLP) system Au-Sn-Au was developed for potential medical applications in hybrid microsystems. The high and low melting phases Au and Sn were deposited onto diverse substrates by magnetron-sputter-ion plating. The coated substrates were soldered in a microsoldering station under different conditions. The influence of soldering conditions on the microstructure and properties of the joints was investigated. Results show that the developed solder led to high-quality joints that can be used in microsystems for medical applications.

Keywords transient liquid phase microtechnology soldering diffusion physical vapor deposition (PVD)

Corresponding Author(s): PERNE Jan,Email:perne@iot.rwth-aachen.de

Issue Date: 05 December 2010

Cite this article:

Kirsten BOBZIN,Nazlim BAGCIVAN,Lidong ZHAO, et al. Development of new transient liquid phase system Au-Sn-Au for microsystem technology[J]. Front Mech Eng Chin, 2010, 5(4): 370-375.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-010-0107-9
https://academic.hep.com.cn/fme/EN/Y2010/V5/I4/370

Fig.1 Transient liquid phase process. (a) Initial solder composition; (b) solder at soldering temperature, diffusion of high-melting elements to liquid phase; (c) soldered joint after isothermal solidification

Tab.1 Parameters for MSIP process

Tab.2 Soldering parameters

Fig.2 Cross-section of an Au-Sn-Ti coated glass substrate

Fig.3 Calotte projection of an Au-Sn-Ti coated glass substrate

Fig.4 Cross-section of joint with glass substrates soldered at 270°C for 30 min

Fig.5 Cross-section of joint with glass and Si substrates soldered at 400°C for 1 h

Fig.6 Cross-section of joint with AlO and glass substrates soldered at 400°C for 1 h

Fig.7 Left: soldered at 270°C for 60 min with resulting phases AuSn-(1), AuSn -(2), and AuSn -(3); right: soldered at 400°C for 60 min with homogeneous gold rich phase (more than 10 at.-% Sn) at (1), (2), and (3)

Fig.8 Phase diagram of Au-Sn

Tab.3 Shear strengths of soldered joints with different substrates

Tab.4 Number of thermo-shock cycles without the occurrence of macroscopical damages

Fig.9 Soldered joint after four days in simulated body fluid

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