Dimethicone-aided laser cutting of solar rolled glass

doi:10.1007/s11465-020-0615-1

Front. Mech. Eng.

2021, Vol. 16

Issue (1) : 111-121 https://doi.org/10.1007/s11465-020-0615-1

RESEARCH ARTICLE

Dimethicone-aided laser cutting of solar rolled glass

Wenyuan LI¹, Guojun ZHANG¹, Long CHEN¹, Yu HUANG¹, Youmin RONG¹(

), Zhangrui GAO²

¹. State Key Laboratory of Digital Manufacturing Equipment and Technology, Huazhong University of Science and Technology, Wuhan 430074, China; School of Mechanical Science and Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
². HG Farley Laserlab Cutting Welding System Engineering Co., Ltd., Wuhan 430223, China

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Abstract

Solar rolled glass, with one micro-structure surface and another roughness surface, can cause diffuse refraction of the focused laser spot, and this phenomenon restricts the application of laser manufacturing. In this study, laser cutting of solar rolled glass with a thickness of 2.5 mm was successfully achieved with the help of dimethicone to ensure laser focusing. Dimethicone was coated on the top surface of the rolled glass processing zone, and a Z bottom–up multilayer increment with the X–Y spiral line was applied to control the cutting path. Different viscosity values of dimethicone were considered. Results showed that surface quality increased as the viscosity increased until a certain threshold was reached; afterward, the surface quality decreased or directly caused the cutting to fail. The minimum surface roughness (3.26 µm) of the processed surface (chipping: Width≤113.64 µm, area 215199 µm²) was obtained when the dimethicone viscosity and laser pulse frequency were 1000 mm²/s and 43 kHz (power 25.4 W), respectively. The micro-defects on the processed surface were few, and the edge chipping width and depth of the laser processed surface were small.

Keywords laser cutting solar rolled glass dimethicone viscosity surface quality

Corresponding Author(s): Youmin RONG

Just Accepted Date: 24 December 2020 Online First Date: 18 January 2021 Issue Date: 11 March 2021

Cite this article:

Wenyuan LI,Guojun ZHANG,Long CHEN, et al. Dimethicone-aided laser cutting of solar rolled glass[J]. Front. Mech. Eng., 2021, 16(1): 111-121.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-020-0615-1
https://academic.hep.com.cn/fme/EN/Y2021/V16/I1/111

Fig.1 Schematic of the solar rolled glass surface: (a) Suede surface of glass and (b) hexagonal embossed surface of glass.

Fig.2 Schematic of solar rolled glass laser cutting.

Fig.3 Schematic of the laser spot cutting assisted by dimethicone: (a) Without auxiliary dimethicone and (b) with auxiliary dimethicone.

Fig.4 Experimental setup for the laser cutting of solar rolled glass.

Tab.1 Process parameters and their levels

Fig.5 Effect of dimethicone viscosity on glass edge chipping under different laser processing conditions: (a) Chipping area and (b) maximum chipping width. Exp.: Experiment.

Fig.6 Refractive index and surface tension of dimethicone under different viscosity values.

Fig.7 Typical glass chipping under different dimethicone viscosities and cutting conditions. Processing condition B under dimethicone viscosities of (a) 0.65 mm²/s, (b) 1000 mm²/s, and (c) 3000 mm²/s; 0.65 mm²/s dimethicone viscosity under (d) processing condition A, (e) processing condition B, and (f) processing condition C.

Fig.8 Effect of dimethicone viscosity on laser-processed surface roughness under different laser processing conditions. Exp.: Experiment.

Fig.9 Profile of the chipping area under different chipping values: (a) Processing condition A, 0.65 mm²/s, maximum chipping width: 307.35 µm; (b) processing condition B, 1000 mm²/s, maximum chipping width: 112.45 µm; and (c) processing condition C, 12500 mm²/s, maximum chipping width: 234.37 µm.

Fig.10 Surface topography of the laser-processed surface under different parameters: (a) Processing condition A, 0.65 mm²/s, Ra: 5.47 µm; (b) 3D topography corresponding to (a); (c) processing condition B, 1000 mm²/s, Ra: 3.21 µm; (d) 3D topography corresponding to (c); (e) processing condition C, 12500 mm²/s, Ra: 5.12 µm; and (f) 3D topography corresponding to (e).

Fig.11 SEM images of the laser-processed surface under different parameters: (a) Processing condition A, 0.65 mm²/s; (b) enlarged SEM image corresponding to (a); (c) processing condition B, 1000 mm²/s; (d) enlarged SEM image corresponding to (c); (e) processing condition C, 12500 mm²/s; and (f) enlarged SEM image corresponding to (e).

Fig.12 SEM images of the laser-processed surface edge under different parameters: (a) Processing condition A, 0.65 mm²/s; (b) processing condition B, 1000 mm²/s; and (c) processing condition C, 12500 mm²/s.

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