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Frontiers of Materials Science

ISSN 2095-025X

ISSN 2095-0268(Online)

CN 11-5985/TB

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Front. Mater. Sci.    2019, Vol. 13 Issue (1) : 64-76    https://doi.org/10.1007/s11706-019-0446-3
RESEARCH ARTICLE
Improved thermal conductivity and dielectric properties of flexible PMIA composites with modified micro- and nano-sized hexagonal boron nitride
Guangyu DUAN1, Yan WANG1, Junrong YU1, Jing ZHU2, Zuming HU1()
1. State Key Laboratory for Modification of Chemical Fibers and Polymer Materials, Donghua University, Shanghai 201620, China
2. College of Materials Science and Engineering, Donghua University, Shanghai 201620, China
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Abstract

A series of flexible poly(m-phenylene isophthalamide) (PMIA)-based composites with different sizes and mass fractions of hexagonal boron nitride (hBN) were successfully manufactured for the first time via the casting technique. The effects of modified hBN particles on microstructure, mechanical properties, dielectric properties and thermal conductivities of fabricated composites were investigated. The results indicate that modified hBN particles manifest good compatibility with the PMIA matrix. The Young’s modulus and Theat-resistance index of PMIA-based composites are increased with increasing the mass fraction of hBN particles. Due to additional thermal conductive paths and networks formed by nano-sized hBN particles, the K-m/n-hBN-30 composite displays the thermal conductivity of 0.94 W·m−1·K−1, higher than that of the K-m-hBN-30 composite (0.86 W·m−1·K−1), and more than 4 times higher than that of neat PMIA. Moreover, the obtained PMIA-based composites also show low dielectric constant and ideal dielectric loss. Owing to the excellent comprehensive performance, hBN/PMIA composites present potential applications in the broad field of electronic materials.
Keywords poly(m-phenylene isophthalamide) (PMIA)      thermal conductivity      hBN particles      dielectric property     
Corresponding Author(s): Zuming HU   
Online First Date: 22 February 2019    Issue Date: 07 March 2019
 Cite this article:   
Guangyu DUAN,Yan WANG,Junrong YU, et al. Improved thermal conductivity and dielectric properties of flexible PMIA composites with modified micro- and nano-sized hexagonal boron nitride[J]. Front. Mater. Sci., 2019, 13(1): 64-76.
 URL:  
https://academic.hep.com.cn/foms/EN/10.1007/s11706-019-0446-3
https://academic.hep.com.cn/foms/EN/Y2019/V13/I1/64
Fig.1  Thermal conductivity models of different PMIA-based composites.
Fig.2  Morphologies of hBN particles: (a) micro-sized particles before the heat treatment; (b) micro-sized particles after the heat treatment; (c) nano-sized particles before the heat treatment; (d) nano-sized particles after the heat treatment.
Fig.3  Reaction procedures for the preparation of KH-550-modified hBN particles.
Fig.4  (a) FTIR spectra of pristine hBN, heat-treated hBN and K-m-hBN. (b) XPS survey scans of pristine hBN and K-m-hBN. (c) XRD curves of pristine hBN, K-m-hBN and K-n-hBN. (d) XRD curves of N-PMIA, K-m-hBN-30 and K-m/n-hBN-30.
Fig.5  SEM images of impact fractures of (a) N-PMIA, (b) K-m-hBN-10, (c) K-m/n-hBN-10, (d) K-m-hBN-20, (e) K-m/n-hBN-20, (f) K-m-hBN-30 and (g) K-m/n-hBN-30 (blue circles showing voids and white lines indicating thermal conductive paths).
Fig.6  (a) Tensile strength, (b) Young’s modulus, and (c) elongation at break values of K-m-hBN and K-m/n-hBN.
Fig.7  Transparency (upper) and flexibility (lower) of (a)(c) K-m-hBN-30 film and (b)(d) K-m/n-hBN-30 film.
Fig.8  (a) DSC curves of PMIA-based composites. (b) TGA curves of pristine hBN and K-m-hBN particles. (c) TGA curves of PMIA-based composites. (d) Partial enlargement of curves in (c).
Sample Mass loss temperature Theat-resistance index/°C Tg/°C
T5%/°C T10%/°C T30%/°C
N-PMIA 408.2 458.2 563.2 216.2 278.4
10% K-m-hBN 431.6 481.6 571.6 237.0 279.5
20% K-m-hBN 427.0 477.0 573.0 237.5 280.1
30% K-m-hBN 432.7 487.7 572.7 237.9 278.3
10% K-m/n-hBN 413.5 463.5 556.0 230.0 280.2
20% K-m/n-hBN 423.1 475.6 563.3 233.1 280.5
30% K-m/n-hBN 424.1 479.1 569.1 234.3 278.1
Tab.1  Characteristic thermal data of N-PMIA and its composites
Fig.9  (a)(b)(c)(d) Dielectric constants and dielectric losses curves of PMIA-based composites. (e)(f) Dielectric constants and dielectric losses curves of K-m-hBN-30 and K-m/n-hBN-30 before and after treating at 200 °C. (g) Dielectric strength of PMIA-based composites.
Sample Mass fraction/% Density/(kg·m−3) Specific heat capacity /(kJ·kg−1·K−1) Thermal diffusivity /(m2·s−1) Thermal conductivity /(W·m−1·K−1)
N-PMIA ? 1340 1370 1.26153×10−7 0.23
K-m-hBN 10 1460 1150 2.05675×10−7 0.35
20 1530 1020 3.0141×10−7 0.47
30 1610 940 5.65371×10−7 0.86
K-m/n-hBN 10 1470 1140 2.17215×10−7 0.36
20 1530 1030 3.61459×10−7 0.57
30 1620 930 6.25565×10−7 0.94
Tab.2  Thermal conductivities of N-PMIA and its PMIA-based composites
Fig.10  (a) Thermal conductivity and (b) thermal conductivity enhancement of PMIA-based composites with different mass fractions of hBN.
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