A review on ductile mode cutting of brittle materials

doi:10.1007/s11465-018-0504-z

Front. Mech. Eng.

2018, Vol. 13

Issue (2) : 251-263 https://doi.org/10.1007/s11465-018-0504-z

REVIEW ARTICLE

A review on ductile mode cutting of brittle materials

Elijah Kwabena ANTWI¹, Kui LIU²(

), Hao WANG¹

¹. Department of Mechanical Engineering, National University of Singapore, Singapore
². Singapore Institute of Manufacturing Technology, Singapore

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Abstract

Brittle materials have been widely employed for industrial applications due to their excellent mecha-nical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.

Keywords ductile mode cutting brittle materials critical undeformed chip thickness brittle-ductile transition subsurface damage molecular dynamic simulation

Corresponding Author(s): Kui LIU

Just Accepted Date: 15 January 2018 Online First Date: 01 March 2018 Issue Date: 16 March 2018

Cite this article:

Elijah Kwabena ANTWI,Kui LIU,Hao WANG. A review on ductile mode cutting of brittle materials[J]. Front. Mech. Eng., 2018, 13(2): 251-263.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-018-0504-z
https://academic.hep.com.cn/fme/EN/Y2018/V13/I2/251

Fig.1 Schematic diagrams of two cutting modes for brittle materials [⁵]. (a) DMC by removing a ductile metallized layer resulted from the large contact pressure in cutting region; (b) BMC by material fracture leaving subsurface damages, of which the subsurface damage is as deep as 5–10 µm due to crack propagations in machining of silicon

Fig.2 An indentation model of elastic-plastic behaviour [²¹]

Fig.3 Schematic diagram illustrated brittle-ductile transition in grooving [³¹]

Fig.4 A turning model considering the damaged depth [⁴³]

Fig.5 SEM photograph of the groove surface achieved in turning of soda-lime glass [⁴³]

Fig.6 Schematic illustration of DMC chip formation [⁴³]. (a)

2 R a o − a o 2 ≤ f

; (b)

2 R a o − a o 2 > f

Fig.7 SEM photos of chips formation in cutting of WC [¹⁴]. (a) d_max = 920 nm; (b) d_max = 1164 nm

Fig.8 SEM photos of chip formation in turning of silicon [⁴⁵]. (a) d_max = 20 nm; (b) d_max = 690 nm

Fig.9 Measured surface roughness in cutting of single crystal silicon wafer [⁵⁷]

Fig.10 SEM photographs obtained surfaces in cutting of WC [⁶⁰]. (a) d_max of 644 nm; (b) d_max of 1164 nm

Fig.11 SEM and AFM photos obtained surfaces in turning of silicon [⁴,⁵⁷]. (a) d_max of 65 nm; (b) d_max of 348 nm; (c) d_max of 65 nm; (d) d_max of 348 nm

Fig.12 Molecular dynamic simulation model of nanoscale DMC [⁴⁰,⁷⁸]

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