Advances in molecular dynamics simulation of ultra-precision machining of hard and brittle materials

doi:10.1007/s11465-017-0412-7

Front. Mech. Eng.

2017, Vol. 12

Issue (1) : 89-98 https://doi.org/10.1007/s11465-017-0412-7

REVIEW ARTICLE

Advances in molecular dynamics simulation of ultra-precision machining of hard and brittle materials

Xiaoguang GUO,Qiang LI(

),Tao LIU,Renke KANG,Zhuji JIN,Dongming GUO

Key Laboratory for Precision & Non-traditional Machining of Ministry of Education, Dalian University of Technology, Dalian 116024, China

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Abstract

Hard and brittle materials, such as silicon, SiC, and optical glasses, are widely used in aerospace, military, integrated circuit, and other fields because of their excellent physical and chemical properties. However, these materials display poor machinability because of their hard and brittle properties. Damages such as surface micro-crack and subsurface damage often occur during machining of hard and brittle materials. Ultra-precision machining is widely used in processing hard and brittle materials to obtain nanoscale machining quality. However, the theoretical mechanism underlying this method remains unclear. This paper provides a review of present research on the molecular dynamics simulation of ultra-precision machining of hard and brittle materials. The future trends in this field are also discussed.

Keywords MD simulation ultra-precision machining hard and brittle materials machining mechanism review

Corresponding Author(s): Qiang LI

Just Accepted Date: 06 December 2016 Online First Date: 26 December 2016 Issue Date: 21 March 2017

Cite this article:

Xiaoguang GUO,Qiang LI,Tao LIU, et al. Advances in molecular dynamics simulation of ultra-precision machining of hard and brittle materials[J]. Front. Mech. Eng., 2017, 12(1): 89-98.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-017-0412-7
https://academic.hep.com.cn/fme/EN/Y2017/V12/I1/89

Fig.1 Different research contents of the studies

Fig.2 Scratching process plot with different sizes of abrasive particles [21]

Fig.3 Force acting on the cutting tool and the stressed zones in the chip formation zone [36]

Fig.4 Normal stresses s_xx, s_yy and shear t_xy in the chip formation Zone A in cutting at different undeformed chip thicknesses [36]

Fig.5 Normal stresses s_xx, s_yy and shear t_xy in the chip formation Zone B in cutting with tools of different cutting edge radii [36]

Fig.6 MD simulation of nanometric cutting of single crystal aluminum with the (111) [211] orientation showing dislocations generated ~60° to the cutting direction [40]

Fig.7 Screw-dislocation loop formed at the initial stage of the stair-rod dislocation formation at the cutting distance of 25 nm (the point defects are cleared in the right figure) [43]

Fig.8 Deformation of the grain boundary zone [52]

Fig.9 Stacking fault model [69]

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