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Frontiers of Materials Science

ISSN 2095-025X

ISSN 2095-0268(Online)

CN 11-5985/TB

Postal Subscription Code 80-974

2018 Impact Factor: 1.701

Front Mater Sci    2011, Vol. 5 Issue (2) : 146-159    https://doi.org/10.1007/s11706-011-0126-4
RESEARCH ARTICLE
Numerical simulation of solidification and liquation behavior during welding of low-expansion superalloys
Shao-Qing GUO(), Xiao-Hong LI
Beijing Institute of Aeronautical Materials, Beijing 100095, China
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Abstract

Low-expansion superalloys are susceptible to weld solidification cracks and heat-affected zone (HAZ) microfissures. To predict solidification cracking, QBasic procedures were developed and solidification reaction sequence, type, and amount of eutectic product were calculated. As manifested, primary solidification is followed by L → (γ+NbC) and L → (γ+Laves) eutectic reaction sequentially for GH903 and GH907; hence, the terminal eutectic constituents are made up of γ/NbC and γ/Laves. While for GH909, only reaction L → (γ+Laves) occurs and more γ/Laves eutectic forms. Therefore, GH909 is more sensitive to solidification cracking. To predict HAZ liquation, cracking Visual FORTRAN procedures were developed, and constitutional liquation of NbC was simulated. As shown, solid dissolution of NbC prior to liquation decreases, and initial liquid film increases with the rate of thermal cycle. Higher rate of thermal cycle promotes the melting of the matrix adjacent to the liquid film and postpones the solidification of the liquid by the liquid-to-γ mode. Thus, more residual liquid film remains at the eutectic point, which will promote HAZ microfissuring. The increase in original grain size and peak temperature also promotes liquation. Finally, these conclusions were verified indirectly by hot ductility tests.

Keywords solidification cracking      HAZ microfissuring      constitutional liquation      low-expansion superalloy      numerical simulation     
Corresponding Author(s): GUO Shao-Qing,Email:shaoqing.guo@biam.ac.cn   
Issue Date: 05 June 2011
 Cite this article:   
Shao-Qing GUO,Xiao-Hong LI. Numerical simulation of solidification and liquation behavior during welding of low-expansion superalloys[J]. Front Mater Sci, 2011, 5(2): 146-159.
 URL:  
https://academic.hep.com.cn/foms/EN/10.1007/s11706-011-0126-4
https://academic.hep.com.cn/foms/EN/Y2011/V5/I2/146
Fig.1  Liquidus projection for γ-Nb-C pseudoternary system.
ParameterValue
kγ,Nb0.25
kγ,C0.21
cNbC,Nb /wt.%Nb90.5
cNbC,C /wt.%C9.5
a /wt.%C1.37
b /(wt.%C/wt.%Nb)-0.065
cNb,L→(γ+Laves) /wt.%Nb20.4
cC,L→(γ+Laves) /wt.%C0.04
Tab.1  Parameters for solidification modeling
Alloy[C] /wt.%[Nb] /wt.%
GH9030.023.0
GH9070.034.7
GH9090.014.7
Tab.2  Basic compositions used in modeling of the three superalloys
Fig.2  Composition variation in liquid as a function of fraction liquid during solidification of low-expansion superalloys: GH903; GH907; GH909.
Fig.3  Solidification paths of low-expansion superalloys.
AlloyTotal eutectic constituentsγ/NbCγ/Laves
GH9030.0800.0070.073
GH9070.1480.0160.132
GH9090.1410.141
Tab.3  Calculated Eutectic constituents during solidification of low-expansion superalloys (in volume fraction)
PositionOverallIterdendritic region (γ/Laves)γ dendrite core
wt.% Nb4.720.522.39
Tab.4  Nb segregation between dendrite core and interdendritic region measured by EDS in the weld of GH909
Fig.4  Solidification paths of GH909with different C contents.
[C] /wt.%γ/NbCγ/LavesTotal eutectic constituents
0.010.1410.141
0.030.0160.1320.148
0.050.0360.1220.158
Tab.5  Eutectic constituents of GH909 with different C contents
Fig.5  Phase diagram and transformation in alloy of composition during subsolidus thermal cycle.
Fig.6  The system investigated and the mesh grid used for computation.
Fig.7  The concentration distributions of Nb at different stages of constitutional liquation of HAZ NbC: Stage 1; Stage 2; the heating portion of Stage 3; the cooling portion of Stage 3.
Fig.8  Variations of dissolved thickness of NbC with temperature at different rates of thermal cycle during Stage 1.
Rate of thermal cycle /(K·s-1)Dissolved thickness of NbC at Stage 1 /μmTemperature range for liquation TR /KInitial thickness of liquid film /μmThickness of residual liquid film at TE /μm
10.565131.06363.37830
100.184603.18923.50400.8467
1000.0739669.85683.56633.1127
10000.05333130.61463.65824.2033
100000.05097290.82313.90643.9599
Tab.6  Computation results of indexes at different stages for various rates of thermal cycles ( = 1600 K)
Fig.9  Evolution of the thickness of liquid film during Stage 3 with different rates of thermal cycle.
Fig.10  Evolution of the thickness of liquid film during Stage 3 with different original grain sizes.
Fig.11  Evolution of the thickness of liquid film during Stage 3 with different peak temperature where the original grain is 100 μm in diameter.
Fig.12  Fracture morphology of specimen fractured at 1423 K on cooling in hot ductility tests: contrast test; fast test.
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