Subsurface damage pattern and formation mechanism of monocrystalline β-Ga2O3 in grinding process

doi:10.1007/s11465-022-0677-3

Front. Mech. Eng.

2022, Vol. 17

Issue (2) : 21 https://doi.org/10.1007/s11465-022-0677-3

RESEARCH ARTICLE

Subsurface damage pattern and formation mechanism of monocrystalline β-Ga₂O₃ in grinding process

Xin YANG, Renke KANG, Shang GAO(

), Zihe WU, Xianglong ZHU

Key Laboratory for Precision and Non-Traditional Machining Technology of Ministry of Education, Dalian University of Technology, Dalian 116024, China

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Abstract

Monocrystalline beta-phase gallium oxide (β-Ga₂O₃) is a promising ultrawide bandgap semiconductor material. However, the deformation mechanism in ultraprecision machining has not yet been revealed. The aim of this study is to investigate the damage pattern and formation mechanism of monocrystalline β-Ga₂O₃ in different grinding processes. Transmission electron microscopy was used to observe the subsurface damage in rough, fine, and ultrafine grinding processes. Nanocrystals and stacking faults existed in all three processes, dislocations and twins were observed in the rough and fine grinding processes, cracks were also observed in the rough grinding process, and amorphous phase were only present in the ultrafine grinding process. The subsurface damage thickness of the samples decreased with the reduction in the grit radius and the grit depth of cut. Subsurface damage models for grinding process were established on the basis of the grinding principle, revealing the mechanism of the mechanical effect of grits on the damage pattern. The formation of nanocrystals and amorphous phase was related to the grinding conditions and material characteristics. It is important to investigate the ultraprecision grinding process of monocrystalline β-Ga₂O₃. The results in this work are supposed to provide guidance for the damage control of monocrystalline β-Ga₂O₃ grinding process.

Keywords monocrystalline beta-phase gallium oxide grinding process subsurface damage nanocrystals amorphous phase

Corresponding Author(s): Shang GAO

About author:

Tongcan Cui and Yizhe Hou contributed equally to this work.

Just Accepted Date: 12 April 2022 Issue Date: 10 June 2022

Cite this article:

Xin YANG,Renke KANG,Shang GAO, et al. Subsurface damage pattern and formation mechanism of monocrystalline β-Ga₂O₃ in grinding process[J]. Front. Mech. Eng., 2022, 17(2): 21.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-022-0677-3
https://academic.hep.com.cn/fme/EN/Y2022/V17/I2/21

Fig.1 (a) Schematic of the wafer rotation grinder and (b) grinding equipment.

Tab.1 Experimental parameters in rough, fine, and ultrafine grinding processes

Fig.2 SEM image of the rough ground surface with the wheel grit size of SD600.

Fig.3 Bright-field cross-sectional TEM/HRTEM images of sample 1 (Part I): (a) overall morphology, (b) enlarged view at the top of the damage area, (c) enlarged view at the bottom of the damage area, and (d) enlarged view at the bottom of (c). The insets are the corresponding selected area electron diffraction patterns.

Fig.4 Bright-field cross-sectional TEM/HRTEM images of sample 1 (Part II): (a) partial morphology, (b) enlarged view at the top of (a), (c) another partial morphology, and (d) enlarged view in the middle of (c).

Fig.5 SEM image of the fine ground surface with the wheel grit size of SD5000.

Fig.6 Bright-field cross-sectional TEM/HRTEM images of sample 2: (a) overall morphology, (b) enlarged view at the top of the damage area, (c) enlarged view in the middle of the damage area, and (d) enlarged view at the bottom of the damage area. The insets are the corresponding SAED patterns.

Fig.7 SEM image of the ultrafine ground surface with the wheel grit size of SD12000.

Fig.8 Bright-field cross-sectional TEM/HRTEM images of sample 3: (a) overall morphology, (b) enlarged view at the top of the damage area, (c) enlarged view on the top right corner of the damage area, and (d) enlarged view at the bottom of the damage area. The insets are the corresponding SAED and FFT patterns.

Fig.9 Schematic of subsurface damage patterns in grinding processes: (a) rough grinding process, (b) fine grinding process, and (c) ultrafine grinding process.

Fig.10 (a) Subsurface damage thickness of samples and (b) grit radius and grit depth of cut of grinding wheels.

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