Additive direct-write microfabrication for MEMS: A review

doi:10.1007/s11465-017-0484-4

Front. Mech. Eng.

2017, Vol. 12

Issue (4) : 490-509 https://doi.org/10.1007/s11465-017-0484-4

REVIEW ARTICLE

Additive direct-write microfabrication for MEMS: A review

Kwok Siong TEH(

)

School of Engineering, San Francisco State University, San Francisco, CA 94132, USA

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Abstract

Direct-write additive manufacturing refers to a rich and growing repertoire of well-established fabrication techniques that builds solid objects directly from computer-generated solid models without elaborate intermediate fabrication steps. At the macroscale, direct-write techniques such as stereolithography, selective laser sintering, fused deposition modeling ink-jet printing, and laminated object manufacturing have significantly reduced concept-to-product lead time, enabled complex geometries, and importantly, has led to the renaissance in fabrication known as the maker movement. The technological premises of all direct-write additive manufacturing are identical—converting computer generated three-dimensional models into layers of two-dimensional planes or slices, which are then reconstructed sequentially into three-dimensional solid objects in a layer-by-layer format. The key differences between the various additive manufacturing techniques are the means of creating the finished layers and the ancillary processes that accompany them. While still at its infancy, direct-write additive manufacturing techniques at the microscale have the potential to significantly lower the barrier-of-entry—in terms of cost, time and training—for the prototyping and fabrication of MEMS parts that have larger dimensions, high aspect ratios, and complex shapes. In recent years, significant advancements in materials chemistry, laser technology, heat and fluid modeling, and control systems have enabled additive manufacturing to achieve higher resolutions at the micrometer and nanometer length scales to be a viable technology for MEMS fabrication. Compared to traditional MEMS processes that rely heavily on expensive equipment and time-consuming steps, direct-write additive manufacturing techniques allow for rapid design-to-prototype realization by limiting or circumventing the need for cleanrooms, photolithography and extensive training. With current direct-write additive manufacturing technologies, it is possible to fabricate unsophisticated micrometer scale structures at adequate resolutions and precisions using materials that range from polymers, metals, ceramics, to composites. In both academia and industry, direct-write additive manufacturing offers extraordinary promises to revolutionize research and development in microfabrication and MEMS technologies. Importantly, direct-write additive manufacturing could appreciably augment current MEMS fabrication technologies, enable faster design-to-product cycle, empower new paradigms in MEMS designs, and critically, encourage wider participation in MEMS research at institutions or for individuals with limited or no access to cleanroom facilities. This article aims to provide a limited review of the current landscape of direct-write additive manufacturing techniques that are potentially applicable for MEMS microfabrication.

Keywords direct-write additive manufacturing microfabrication MEMS

Corresponding Author(s): Kwok Siong TEH

Just Accepted Date: 04 September 2017 Online First Date: 08 November 2017 Issue Date: 31 October 2017

Cite this article:

Kwok Siong TEH. Additive direct-write microfabrication for MEMS: A review[J]. Front. Mech. Eng., 2017, 12(4): 490-509.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-017-0484-4
https://academic.hep.com.cn/fme/EN/Y2017/V12/I4/490

Tab.1 Summary of various direct-write fabrication techniques that are amenable to MEMS fabrication

Fig.1 (a) Set up of a projection microstereolithography system. (b) Micro matrix with suspended beam diameter of 5 mm. Scale bar: 200 mm. (c) High aspect-ratio micro rod array consists of 21 × 11 rods with the overall size of 2 mm × 1 mm. Scale bar: 100 mm. The rod diameter and height is of 30 mm and 1 mm, respectively. (d) Helical structures with the coil’s diameter of 500 mm and the filament’s diameter of 130 mm. Scale bar: 200 mm. (e) 3D magnetic particle-polymer composite microfan with a diameter of 500 mm and height of 250 mm. (f)–(h) are silica nanoparticle-infused polymer (poly(hydroxyethylmethacrylate), pHEMA) nanocomposite. (f) Microfluidic chip. Inset scale bar: 200 ?mm. (g) Micro-optical diffractive structure creating the optical projection pattern shown at the bottom (illuminated with a green laser pointer). Scale bar: 100? mm. (h) Microlenses fabricated using greyscale lithography. Inset scale bar: 100? mm. (i) Metal-coated photopolymer micro-grippers printed using microstereolithography, juxtaposed against a 20-pence British coin and (j) a sample lateral displacement vs. applied potential at the micro-gripper tip. Figures are reprinted with permission from the following sources: (a) and (d) from Ref. [77]; (b) and (c) from Ref. [74]; (e) from Ref. [78]; (f), (g), and (h) from Ref. [79]; (i) and (j) from Ref. [80]

Fig.2 (a) A compound objective lens (blue) fabricated directly on an optical fiber (red) inserted within a 27-gauge needle. (b) Scanning electron microscope images of a doublet lenses printed with a 90° piece cut out to provide a better view of the different lenses. Scale bar: 20 µm. (c) An Omnivision 5647 CMOS image sensor with doublet lenses (inset). The CMOS-chip has a pixel size of 1.4? µm×?1.4 µm. Reprinted with permission from Ref. [87]. (d)–(e) Microfabrication with the continuous liquid interface production (CLIP) technique. (d) Micropaddles with stems 50 mm in diameter. (e) The CLIP process enables fast print speeds and layerless part construction. Reprinted with permission from Ref. [89]

Fig.3 (a)–(d) 3D microparts produced by an LMS process using q-switched laser pulses and in an oxygen-free, shield gas environment. (a), (b) Bihelical tungsten coil, 300 mm in wire diameter. Scale bar: 700 µm. (c) Coiled tungsten ligament (35 mm width, 300 mm height). Scale bar: 400 µm. (d) Top view of coiled tungsten ligament in (c). Scale bar: 200 µm. (e) Microturbine of SiSiC (diameter= 6 mm, blade thickness= 500 mm). (f) Detail of a valve generated under ambient conditions from 10 mm sinter layers of a 10 mm grained nickel-chromium alloy powder (nichrome 80/20). Reprinted with permission from Refs. [98,109]

Fig.4 (a) Schematic of a laser-induced forward transfer (LIFT) process. (b)–(e) Microstructures fabricated by a LIFT process, and cured at 70 °C, 1 h. (b) A 5 mm-thick rectangular voxel crossing a 100 µm wide silicon channel. Scale bar: 50 µm. (c) Multilayer scaffold structure. Scale bar: 20 µm. (d) A high aspect ratio micro pyramid (100 mm × 100 mm × 60 mm). Scale bar: 20 µm. (e) High aspect ratio micro pillars made by stacking 20 individual voxels of 30 mm × 30 mm area, each 3.75 mm thick. Scale bar: 40 µm. (f) FIB machined microbridge, thickness= 460 nm. Inset depicts the machined area(s). (g) FIB machined cantilever, thickness= 460 nm. Dynamic responses of (h) the microcantilever and (i) doubly clamped microbridge as measured by laser vibrometry. Reprinted with permission from Refs. [114,115]

Fig.5 (a) A selection of the different carbon micro-springs fabricated using LCVD. Scale bar: 1 mm. (b) Modulus of elasticity of LCVD-deposited carbon as a function of laser power (LP) and ethylene pressure (GPa). (c)–(d) SEM photos of two springs deposited at 400?mW laser power and 50 kPa ethylene. (c) Spring deposited at a translation speed of 0.5 mm/s and having a deposition rate of 6.75 mm/s and a wire diameter of 67 mm. Scale bar: 100 mm. (d) Spring deposited at a translation speed of 1.0 mm/s and having a deposition rate of 7.18 mm/s and a wire diameter of 75 mm. Scale bar: 200 mm. Reprinted with permission from Ref. [133]

Fig.6 (a1)–(a6) Process flow for manufacturing all inkjet-printed piezoelectric polymer actuators. Electrodes and piezoelectric P(VDF-TrFE) layers are printed and sintered/tempered subsequently. (a7) Cross-sectional SEM image of layer sandwich. (a8) Cantilever and (a9) membrane samples mounted. Reprinted with permission from Ref. [147]. (b) Direct ink writing (DIW) techniques developed by Lewis et al. [152] showing an SEM image of lithium-ion microbatteries printed from LiFePO₄ (LFP) and Li₄Ti₅O₁₂ (LTO) inks, respectively. (c) Free-form ink printing of hemispherical spiral from silver paste and immediately post-annealed by IR laser. Reprinted with permission from [149]. (d1)–(d7) 500 µm diameter helical coil going through large extension (strain= 150% in tension) and compression (strain= –50%). (e) A force-extension curve for an 800-mm-tall helix exhibits a linear-elastic behavior up to 50% strain. Reprinted with permission from Ref. [152]

Fig.7 (a) Microfluidics components printed from a ProJet 3000HD 3D printer (3D Systems) based on the extrusion-based fused deposition modeling process. (a1) Fluidic capacitor, (a2) fluidic diode, (a3) fluidic transistor, and (a4) fluidic enhanced gain transistors. Reprinted with permission from Ref. [162]. (b1) Molds for microelectronics components that are printed using ProJet 3000HD 3D printer. Once printed, the inner conduits are filled with conductive silver paste to create an embedded conductive structure. (b2) Microelectronics components after the liquid metal paste filling and curing, including a resistor, an inductor, a capacitor, and an LC tank. (b3) An exposed 4-turn solenoid coil. Reprinted with permission from Ref. [146]

Fig.8 (a) Schematic setup of the 3D electrospinning process and a close-up schematic of stacked 2 µm-fibers made of polyvinylidene difluoride (PVDF). (b) SEM image of a 10-layer, 3D grid structure constructed on a paper substrate, fabricated at a writing speed of 10 mm/s. (c) SEM image showing the magnified image of the crossover area (white box) of the grid in (b). (d) An optical photo showing a whole grid structure held by a tweezer after being physically detached from the paper substrate. Reprinted with permission from Ref. [157]. (e), (f) Multilayered 3D grid structure fabricated by an electrohydrodynamic jet printing technique using polycaprolactone (PCL). Reprinted with permission from Ref. [156]. (g) An aerosol jet printing system. Reprinted with permission from Ref. [159]

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