Development and application of high-end aerospace MEMS

doi:10.1007/s11465-017-0424-3

Front. Mech. Eng.

2017, Vol. 12

Issue (4) : 567-573 https://doi.org/10.1007/s11465-017-0424-3

REVIEW ARTICLE

Development and application of high-end aerospace MEMS

Weizheng YUAN(

)

Key Laboratory of Micro/Nano Systems for Aerospace, Ministry of Education, Xi’an 710072, China; Key Laboratory of Micro/Nano Electromechanical Systems, Xi’an 710072, China; Department of Microsystem Engineering, Northwestern Polytechnical University, Xi’an 710072, China

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Abstract

This paper introduces the design and manufacturing technology of aerospace microelectromechanical systems (MEMS) characterized by high performance, multi-variety, and small batch. Moreover, several kinds of special MEMS devices with high precision, high reliability, and environmental adaptability, as well as their typical applications in the fields of aeronautics and aerospace, are presented.

Keywords MEMS design and manufacture technology aeronautic and aerospace

Corresponding Author(s): Weizheng YUAN

Just Accepted Date: 28 February 2017 Online First Date: 24 March 2017 Issue Date: 31 October 2017

Cite this article:

Weizheng YUAN. Development and application of high-end aerospace MEMS[J]. Front. Mech. Eng., 2017, 12(4): 567-573.

URL:

https://academic.hep.com.cn/fme/EN/10.1007/s11465-017-0424-3
https://academic.hep.com.cn/fme/EN/Y2017/V12/I4/567

Fig.1 Schematic of the Pan-structured design

Fig.2 Micro gyroscope with an integrated circuit

Fig.3 Micro programmable grating and multispectral imaging

Fig.4 MEMS typical structure and manufacturing feature

Fig.5 Selective release method. (a) Deep etching; (b) dry release; (c) wet release and cutting; (d) dicing

Fig.6 Microstructures fabricated by combining wet and dry release

Fig.7 Structures of different widths without lag effects

Fig.8 Comb electrodes with different height

Fig.9 Fabrication processes of flexible hot-film sensor array

Fig.10 Flexible hot-film shear stress sensor array

Fig.11 Wind tunnel experiment of ARJ21 model

Fig.12 Floating element wall shear stress micro-sensor

Fig.13 Silicon-based resonant pressure sensor with integrated circuit

Fig.14 (a) Boundary layer changes with and without synthetic jet; (b) wind tunnel test of active flow control

Fig.15 Micro thruster and nanosatellite

Fig.16 Electrostatically actuated micro mirror

Fig.17 High temperature-resistant sensor. (a) Thin film thermocouple; (b) SOI-based wall shear stress sensor; (c) SiC-based dynamic pressure sensor

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