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Electronic properties of monolayer copper selenide with one-dimensional moiré patterns |
Gefei Niu1, Jianchen Lu1(), Jianqun Geng1, Shicheng Li1, Hui Zhang1, Wei Xiong1, Zilin Ruan1, Yong Zhang1, Boyu Fu1, Lei Gao2(), Jinming Cai1() |
1. Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming 650093, China 2. Faculty of Science, Kunming University of Science and Technology, Kunming 650500, China |
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Abstract Strain engineering is a vital way to manipulate the electronic properties of two-dimensional (2D) materials. As a typical representative of transition metal mono-chalcogenides (TMMs), a honeycomb CuSe monolayer features with one-dimensional (1D) moiré patterns owing to the uniaxial strain along one of three equivalent orientations of Cu(111) substrates. Here, by combining low-temperature scanning tunneling microscopy/spectroscopy (STM/S) experiments and density functional theory (DFT) calculations, we systematically investigate the electronic properties of the strained CuSe monolayer on the Cu(111) substrate. Our results show the semiconducting feature of CuSe monolayer with a band gap of 1.28 eV and the 1D periodical modulation of electronic properties by the 1D moiré patterns. Except for the uniaxially strained CuSe monolayer, we observed domain boundary and line defects in the CuSe monolayer, where the biaxial-strain and strain-free conditions can be investigated respectively. STS measurements for the three different strain regions show that the first peak in conduction band will move downward with the increasing strain. DFT calculations based on the three CuSe atomic models with different strain inside reproduced the peak movement. The present findings not only enrich the fundamental comprehension toward the influence of strain on electronic properties at 2D limit, but also offer the benchmark for the development of 2D semiconductor materials.
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Keywords
CuSe monolayer
scanning tunneling microscopy
strain
electronic bandgap
electronic property
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Corresponding Author(s):
Jianchen Lu,Lei Gao,Jinming Cai
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Issue Date: 23 November 2022
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